The mark shows major revised points.
1998
µPC4742ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Voltage between V+ and V– Note 1Differential Input VoltageInput VoltageNote 2Output VoltageNote 3Power Dissipation
C PackageNote 4G2 PackageNote 5
Output Short Circuit DurationNote 6Operating Ambient TemperatureStorage Temperature
TATstgSymbolV+ –V–VIDVIVOPT
Ratings–0.3 to +36
±36
V– –0.3 to V– +36V– –0.3 to V+ +0.3
350440Indefinite–20 to +80–55 to + 125
UnitVVVVmWmWsec°C°C
Notes1.Reverse connection of supply voltage can cause destruction.
2.The input voltage should be allowed to input without damage or destruction independent of themagnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normaloperation will establish when the both inputs are within the Common Mode Input Voltage Range ofelectrical characteristics.
3.This specification is the voltage which should be allowed to supply to the output terminal from externalwithout damage or destructive. Even during the transition period of supply voltage, power on/off etc.,this specification should be kept. The output voltage of normal operation will be the Output Voltage Swingof electrical characteristics.
4.Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C.5.Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C.6.Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note4 and Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Split)Supply Voltage (V– = GND)Output Current
Capacitive Load (AV = +1, Rf = 0 Ω)
V
±
SymbolMIN.±1.5+3
TYP.MAX.±16+32±101000
UnitVVmApF
V+IOCL
2
Data Sheet G13958EJ2V0DS
µPC4742ELECTRICAL CHARACTERISTICS (TA = 25 °C, V± = ±15 V)
Parameter
Input Offset VoltageInput Offset CurrentInput Bias CurrentNote 7Large Signal Voltage GainSupply CurrentNote 8
Common Mode Rejection RatioSupply Voltage Rejection RatioOutput Voltage SwingOutput Voltage Swing
Common Mode lnput Voltage RangeSlew Rate (Rise)Gain Band Width ProductChannel Separation
SymbolVIOIIOIBAVICCCMRSVRVomVomVICMSRGBW
AV = 1, RL ≥ 2 kΩfO = 100 kHzf = 20 Hz to 20 kHzRL ≥ 10 kΩRL ≥ 2 kΩ
RL ≥ 2 kΩ, VO = ±10 VIO = 0 A
7070±13.7±13.5V–
8.53.5120
V+–1.8
25000
Conditions
MIN.
TYP.±1.0±61403000004.38693+14–14.3
5.5
mAdBdBVVVV/µsMHzdB
MAX.±4.5±75500
UnitmVnAnA
ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND)
Parameter
Input Offset VoltageInput Offset CurrentInput Bias CurrentNote 7Large Signal Voltage GainSupply CurrentNote 8
Common Mode Rejection RatioSupply Voltage Rejection RatioOutput Voltage Swing
Common Mode lnput Voltage RangeOutput Current (SOURCE)Output Current (SINK)Slew Rate (Rise)
SymbolVIOIIOIBAVICCCMRSVRVomVICMIO SOURCEIO SINKSR
V+IN = +1 V, V–IN = 0 VV+IN = 0 V, V–IN = +1 VRL ≥ 2 kΩ (Connect to GND)RL ≥ 2 kΩIO = 0 A
70703.7001010
30307
25000
Conditions
MIN.
TYP.±1.0±61603000003.3809.00
V+–1.84.5
mAdBdBVVmAmAV/µs
MAX.±5±75500
UnitmVnAnA
Notes7.Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input
stage.
8.This current flows irrespective of the existence of use.
Data Sheet G13958EJ2V0DS
3
µPC4742TYPICAL CHARACTERISTICS (TA = 25 °C, TYP.)
POWER DISSIPATION50010SUPPLY CURRENTV+A8200 °C/WICCµPC4742G2PT - Total Power Dissipation - mW400ICC - Supply Current - mAµPC4742C–6+V–300227 °C/W2004TA = –20 °CTA = +25 °CTA = +80 °C10020204060801000±5±10±15±20TA - Operating Ambient Temperature - °CV± - Supply Voltage - VINPUT OFFSET VOLTAGECOMMON MODE INPUT VOLTAGE RANGE40VIO - Input Offset Voltage - mV3210–1–2–3–4–5–50050100VICM - Common Mode Input Voltage Range - VV± = ±15Veach 5 samples data3020VICM+10VICM–010203040TA - Operating Ambient Temperature - °CINPUT BIAS CURRENT200200V+ - Supply Voltage - V (V– = GND)INPUT BIAS CURRENTIB - Input Bias Current - nA100IB - Input Bias Current - nA15010050V± = ±15V0102030400–50050100V+ - Supply Voltage - V (V– = GND)TA - Operating Ambient Temperature - °C4
Data Sheet G13958EJ2V0DS
µPC4742OUTPUT SINK CURRENT LIMIT10V+ = 15 V5OUTPUT SOURCE CURRENT LIMITV+ = 15 VV+/2+–V+∆VOIO SOURCE∆VO - Output Voltage to V+ - V1004VO - Output Voltage - V1VV+/2+–+30.1IO SINKVORL210.010.01The dotted line shows a characteristic of RL = 1 kΩ0.11.01000.010.11.010100IO SINK - Output Sink Current - mAIO SOURCE - Output Source Current - mAOPEN LOOP FREQUENCY RESPONSE120V± = ±15 V30LARGE SIGNAL FREQUENCY RESPONSEV± = ±15 VRL = 2 kΩAV - Open Loop Voltage Gain - dB10080604020Vom - Output Voltage Swing - Vp-p20100101001 k10 k100 k1 M10 M01001 k10 k100 k1 M10 Mf - Frequency - Hzf - Frequency - HzVOLTAGE FOLLOWER PULSE RESPONSESLEW RATE12VIN - Input Voltage -V/VO - Output Voltage - V3210RL = 2 kΩV+ = +5 VV– = GND10SR - Slew Rate - V/µ sSR–8SR+63210012342V± = ±15 VRL = 2 kΩ0–50050100µt - Time - sData Sheet G13958EJ2V0DS
TA - Operating Ambient Temperature - °C5
PACKAGE DRAWINGS (Unit: mm)
8-PIN PLASTIC DIP (7.62mm(300))8514AJIPHCGBFDNMNOTES1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition.2. ltem \"K\" to center of leads when formed parallel.6
Data Sheet G13958EJ2V0DS
µPC4742KLMRITEMMILLIMETERSA10.16 MAX.B1.27 MAX.C2. (T.P.)D0.50±0.10F1.4 MIN.G3.2±0.3H0.51 MIN.I4.31 MAX.J5.08 MAX.K7.62 (T.P.)L6.4M0.25+−0.100.05N0.25P0.9 MIN.R0∼15°P8C-100-300B,C-2µPC47428-PIN PLASTIC SOP (5.72 mm (225))85detail of lead endP1AFGSBCDENOTEEach lead centerline is located within 0.12 mm ofits true position (T.P.) at maximum material condition.ITEMABCDEFGHIJKLMNPMILLIMETERS0.175.2+−0.200.78 MAX.1.27 (T.P.)0.080.42+−0.070.1±0.11.59±0.211.496.5±0.34.4±0.151.1±0.20.080.17+−0.070.6±0.20.120.107°3°+−3°S8GM-50-225B-HIJLKNSMMData Sheet G13958EJ2V0DS
7
µPC4742RECOMMENDED SOLDERING CONDITIONS
The µPC4742 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics salesrepresentative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)Type of Surface Mount Device
µPC4742G2: 8-pin plastic SOP (225 mil)
Process
Infrared ray reflow
Conditions
Peak temperature: 230 °C or below (Package surface temperature),Reflow time: 30 seconds or less (at 210 °C or higher),Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),Reflow time: 40 seconds or less (at 200 °C or higher),Maximum number of reflow processes: 1 time.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).Partial heating method
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
–SymbolIR30-00-1
Vapor Phase SolderingVP15-00-1
Wave SolderingWS60-00-1
CautionApply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Type of Through-hole Device
µPC4742C: 8-pin plastic DIP (300 mil)
Process
Wave soldering(only to leads)Partial heating method
Conditions
Solder temperature: 260 °C or below,Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
CautionFor through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
8
Data Sheet G13958EJ2V0DS
µPC4742REFERENCE DOCUMENTS
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICESSEMICONDUCTOR DEVICE MOUNT MANUALC11531E
http://www.necel.com/pkg/en/mount/index.html
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM
IEI-1212
(STANDARD LINEAR IC)
Data Sheet G13958EJ2V0DS
9
µPC4742•The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.•No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.•NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.•Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.•While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.•NEC Electronics products are classified into the following three quality grades: \"Standard\\"Specific\". The \"Specific\" quality grade applies only to NEC Electronics products developed based on a customer-designated \"quality assurance program\" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. \"Standard\":Computers, office equipment, communications equipment, test and measurement equipment, audioand visual equipment, home electronic appliances, machine tools, personal electronic equipmentand industrial robots.\"Special\":Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disastersystems, anti-crime systems, safety equipment and medical equipment (not specifically designedfor life support).\"Specific\":Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, lifesupport systems and medical equipment for life support, etc.The quality grade of NEC Electronics products is \"Standard\" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application.(Note)(1)\"NEC Electronics\" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries.(2)\"NEC Electronics products\" means any product developed or manufactured by or forNEC Electronics (as defined above).M8E 02. 11-1
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