FEATURES
Preliminary Technical Data
Dual Symmetric 600 Mhz High Performance Blackfin Core328 KBytes of On-chip Memory (See Memory Info onPage3) Each Blackfin Core Includes:
Two 16-Bit MACs, Two 40-Bit ALUs, Four 8-Bit Video ALUs, 40-Bit Shifter
RISC-Like Register and Instruction Model for Ease of Pro-gramming and Compiler-Friendly Support
Advanced Debug, Trace, and Performance- Monitoring0.8 - 1.2V core VDD with On-Chip Voltage Regulation3.3V and 2.5V Tolerant I/O
256-Ball Mini BGA and 297-Ball PBGA Package Options
Blackfin® EmbeddedSymmetric Multi-ProcessorADSP-BF561PERIPHERALS
Two Parallel Input/Output Peripheral Interface Units Sup-porting ITU-R 656 Video and Glueless Interface to ADI Analog Front End ADCs
Two Dual Channel, Full Duplex Synchronous Serial Ports Sup-porting Eight Stereo I2S Channels
Dual 16 Channel DMA Controllers and one internal memory DMA controller
12 General Purpose 32-bit Timer/Counters, with PWM Capability
SPI-Compatible Port
UART with Support for IrDA®Dual Watchdog Timers48 Programable Flags
On-Chip Phase Locked Loop Capable of 1x to 63x Frequency Multiplication
IRQCTRL/TIMERVOLTAGEREGULATORBL1INSTRUCTIONMEMORYMMUL1DATAMEMORYBL1INSTRUCTIONMEMORYMMUL1DATAMEMORYIRQCTRL/TIMERJTAGTESTEMULATIONUARTIRDA®SPIL2SRAM128KBYTESSPORT0CORESYSTEM/BUSINTERFACEIMDMACONTROLLERSPORT1EABDMACONTROLLER132DMACONTROLLER2BOOTROM32DABDABPAB1616GPIOTIMERSEXTERNALPORTFLASH/SDRAMCONTROLPPIPPIFigure 1.Functional Block Diagram
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Rev. PrC
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ADSP-BF561
TABLE OF CONTENTS
General Description ................................................. 3Portable Low-Power Architecture ............................. 3Blackfin Processor Core .......................................... 3Memory Architecture ............................................ 4Internal (On-chip) Memory ................................. 4External (Off-Chip) Memory ................................ 5I/O Memory Space ............................................. 6Booting ........................................................... 6Event Handling ................................................. 6Core Event Controller (CEC) ................................ 6System Interrupt Controller (SIC) .......................... 6Event Control ................................................... 7DMA Controllers .................................................. 8WatchDog Timers ................................................ 8Serial Ports (SPORTs) ............................................ 9Serial Peripheral Interface (SPI) Ports ........................ 9UART Port .......................................................... 9Programmable Flags (PFx) .................................... 10Timers ............................................................. 10Parallel Peripheral Interface ................................... 10General Purpose Mode Descriptions .................... 10Input Mode .................................................... 10ITU -R 656 Mode Descriptions ........................... 10Active Video Only Mode ................................... 10Vertical Blanking Interval Mode .......................... 11Entire Field Mode ............................................ 11Dynamic Power Management ................................ 11Full-On Operating Mode – Maximum Performance . 11Active Operating Mode – Moderate Power Savings .. 11Hibernate Operating Mode—Maximum Static Power Savings ....................................................... 11Sleep Operating Mode – High Power Savings ......... 11Deep Sleep Operating Mode – Max. Power Savings .. 11Power Savings ................................................. 12Voltage Regulation .............................................. 12Clock Signals ..................................................... 13Booting Modes ................................................... 13Instruction Set Description ................................... 14
Preliminary Technical Data
Development Tools .............................................. 14Designing an Emulator-Compatible
Processor Board (Target) ................................... 15Additional Information ........................................ 15Pin Descriptions .................................................... 16Specifications ........................................................ 20Recommended Operating Conditions ...................... 20Electrical Characteristics ....................................... 20Absolute Maximum Ratings ................................... 21ESD Sensitivity ................................................... 21Timing Specifications ........................................... 22Clock and Reset Timing ..................................... 23Asynchronous Memory Read Cycle Timing ............ 24Asynchronous Memory Write Cycle Timing ........... 25SDRAM Interface Timing .................................. 26External Port Bus Request and Grant Cycle Timing .. 27 Parallel Peripheral Interface Timing ..................... 28Serial Ports ..................................................... 29Serial Peripheral Interface (SPI) Port—Master Timing 34Serial Peripheral Interface (SPI) Port—Slave Timing . 36Universal Asynchronous Receiver-Transmitter (UART) Port—Receive and Transmit Timing .................. 38Timer Cycle Timing .......................................... 39Programmable Flags Cycle Timing ....................... 40JTAG Test And Emulation Port Timing ................. 41Power Dissipation ............................................... 42Output Drive Currents ......................................... 42Test Conditions .................................................. 42Output Enable Time ......................................... 43Output Disable Time ......................................... 43Example System Hold Time Calculation ................... 43Capacitive Loading .............................................. 44256-ball MBGA Pin Configurations ............................ 45297-ball PBGA Pin Configurations ............................. 47Outline Dimensions ................................................ 50Outline Dimensions ................................................ 51Ordering Guide ..................................................... 51
REVISION HISTORY
Revision PrC:
•Edits made to pinlists and timing specification.
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Preliminary Technical Data
GENERAL DESCRIPTION
The ADSP-BF561 processor is a high-performance member of the Blackfin family of products targeting a variety of multimedia and telecommunications applications. At the heart of this device are two independent Analog Devices Blackfin processors. These Blackfin processors combine a dual-MAC state-of-the-art signal processing engine, the advantage of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, mul-tiple-data (SIMD) multimedia capabilities into a single
instruction-set architecture. The ADSP-BF561 device integrates a general purpose set of digital imaging peripherals creating a complete system on-chip solution for digital imaging and multi-media applications.
The ADSP-BF561 processor has 328 KBytes of on-chip mem-ory. Each Blackfin core includes:
•16K Bytes of Instruction SRAM/Cache•16K Bytes of Instruction SRAM•32K Bytes of Data SRAM/Cache•32K Bytes of Data SRAM•4K Bytes of Scratchpad SRAM
ADSP-BF561
Additional on-chip memory peripherals include:•128 KBytes of Low Latency On-chip SRAM•Four Channel Internal Memory DMA Controller•External Memory controller with glueless support for SDRAM, SRAM, and Flash
PORTABLE LOW-POWER ARCHITECTURE
Blackfin processors provide world-class power management and performance for embedded signal processing applications. Blackfin processors are designed in a low power and low voltage design methodology and feature Dynamic Power Management. Dynamic Power Management is the ability to vary both the volt-age and frequency of operation to significantly lower the overall power dissipation. This translates into an exponential reduction in power dissipation providing longer battery life to portable applications.
BLACKFIN PROCESSOR CORE
As shown in Figure2, each Blackfin core contains two multi-plier/accumulators (MACs), two 40-bit ALUs, four video ALUs, and a single shifter. The computational units process 8-bit, 16-bit, or 32-bit data from the register file.
ADDRESSARITHMETICUNITSPFPP5P4P3P2P1P0I3I2I1I0L3L2L1L0B3B2B1B0M3M2M1M0DAG0DAG1SEQUENCERALIGNDECODER7R6R5R4R3R2R1R016888168CONTROLUNITLOOPBUFFERBARRELSHIFTERA04040A1DATAARITHMETICUNITFigure 2.Blackfin Processor Core
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ADSP-BF561
Each MAC performs a 16-bit by 16-bit multiply in every cycle, with an accumulation to a 40-bit result, providing 8 bits of extended precision. The ALUs perform a standard set of arith-metic and logical operations. With two ALUs capable of
operating on 16- or 32-bit data, the flexibility of the computa-tion units covers the signal processing requirements of a varied set of application needs.
Each of the two 32-bit input registers can be regarded as two 16-bit halves, so each ALU can accomplish very flexible single 16-bit arithmetic operations. By viewing the registers as pairs of 16-bit operands, dual 16-bit or single 32-bit operations can be accomplished in a single cycle. By further taking advantage of the second ALU, quad 16-bit operations can be accomplished simply, accelerating the per cycle throughput.
The powerful 40-bit shifter has extensive capabilities for per-forming shifting, rotating, normalization, extraction, and depositing of data. The data for the computational units is found in a multi-ported register file of sixteen 16-bit entries or eight 32-bit entries.
A powerful program sequencer controls the flow of instruction execution, including instruction alignment and decoding. The sequencer supports conditional jumps and subroutine calls, as well as zero-overhead looping. A loop buffer stores instructions locally, eliminating instruction memory accesses for tight looped code.
Two data address generators (DAGs) provide addresses for simultaneous dual operand fetches from memory. The DAGs share a register file containing four sets of 32-bit Index, Modify, Length, and Base registers. Eight additional 32-bit registers pro-vide pointers for general indexing of variables and stack locations.
Blackfin processors support a modified Harvard architecture in combination with a hierarchical memory structure. Level 1 (L1) memories are those that typically operate at the full processor speed with little or no latency. Level 2 (L2) memories are other memories, on-chip or off-chip, that may take multiple processor cycles to access. At the L1 level, the instruction memory holds instructions only. The two data memories hold data, and a dedi-cated scratchpad data memory stores stack and local variable information. At the L2 level, there is a single unified memory space, holding both instructions and data.
In addition, half of L1 instruction memory and half of L1 data memories may be configured as either Static RAMs (SRAMs) or caches. The Memory Management Unit (MMU) provides mem-ory protection for individual tasks that may be operating on the core and may protect system registers from unintended access.The architecture provides three modes of operation: User mode, Supervisor mode, and Emulation mode. User mode has
restricted access to certain system resources, thus providing a protected software environment, while supervisor mode has unrestricted access to the system and core resources.
The Blackfin instruction set has been optimized so that 16-bit op-codes represent the most frequently used instructions, resulting in excellent compiled code density. Complex DSP instructions are encoded into 32-bit op-codes, representing fully featured multifunction instructions. Blackfin processors sup-Rev. PrC|
Preliminary Technical Data
port a limited multi-issue capability, where a 32-bit instruction can be issued in parallel with two 16-bit instructions, allowing the programmer to use many of the core resources in a single instruction cycle.
The Blackfin assembly language uses an algebraic syntax for ease of coding and readability. The architecture has been opti-mized for use in conjunction with the VisualDSP C/C++ compiler, resulting in fast and efficient software implementations.
MEMORY ARCHITECTURE
The ADSP-BF561 views memory as a single unified 4G-byte address space, using 32-bit addresses. All resources including internal memory, external memory, and I/O control registers occupy separate sections of this common address space. The memory portions of this address space are arranged in a hierar-chical structure to provide a good cost/performance balance of some very fast, low-latency memory as cache or SRAM very close to the processor, and larger, lower-cost and performance-memory systems farther away from the processor. The ADSP-BF561 memory map is shown in Figure3.
The L1 memory system in each core is the highest-performance memory available to each Blackfin core. The L2 memory pro-vides additional capacity with lower performance. Lastly, the off-chip memory system, accessed through the External Bus Interface Unit (EBIU), provides expansion with SDRAM, flash memory, and SRAM, optionally accessing more than 768M bytes of physical memory. The memory DMA controllers pro-vide high-bandwidth data-movement capability. They can perform block transfers of code or data between the internal L1/L2 memories and the external memory spaces.
Internal (On-chip) Memory
The ADSP-BF561 has four blocks of on-chip memory providing high-bandwidth access to the core.
The first is the L1 instruction memory of each Blackfin core consisting of 16K bytes of 4-way set-associative cache memory and 16K bytes of SRAM. The cache memory may also be config-ured as an SRAM. This memory is accessed at full processor speed. When configured as SRAM, each of the two 16K banks of memory is broken into 4K sub-banks which can be indepen-dently accessed by the processor and DMA.
The second on-chip memory block is the L1 data memory of each Blackfin core which consists of four banks of 16K bytes each. Two of the L1 data memory banks can be configured as one way of a two-way set associative cache or as an SRAM. The other two banks are configured as SRAM. All banks are accessed at full processor speed. When configured as SRAM, each of the four 16K banks of memory is broken into 4K sub-banks which can be independently accessed by the processor and DMA.The third memory block associated with each core is a 4K-byte scratchpad SRAM which runs at the same speed as the L1 mem-ories, but is only accessible as data SRAM (it cannot be
configured as cache memory and is not accessible via DMA).
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Preliminary Technical Data
COREAMEMORYMAP0xFFFFFFFF0xFFE000000xFFC000000xFFB010000xFFB000000xFFA140000xFFA100000xFFA040000xFFA000000xFF9080000xFF9040000xFF9000000xFF8080000xFF8040000xFF800000RESERVEDL1SCRATCHPADSRAM(4K)RESERVEDL1INSTRUCTIONSRAM/CACHE(16K)RESERVEDL1INSTRUCTIONSRAM(16K)RESERVEDL1DATABANKBSRAM/CACHE(16K)L1DATABANKBSRAM(16K)RESERVEDL1DATABANKASRAM/CACHE(16K)L1DATABANKASRAM(16K)RESERVEDL1SCRATCHPADSRAM(4K)RESERVEDL1INSTRUCTIONSRAM/CACHE(16K)RESERVEDRESERVEDL1INSTRUCTIONSRAM(16K)RESERVEDL1DATABANKBSRAM/CACHE(16K)L1DATABANKBSRAM(16K)RESERVEDL1DATABANKASRAM/CACHE(16K)L1DATABANKASRAM(16K)0xFEB200000xFEB000000xEF0040000xEF0000000x300000000x2C0000000x280000000x240000000x20000000TopoflastSDRAMpageRESERVEDL2SRAM(128K)RESERVEDBOOTROMRESERVEDASYNCMEMORYBANK3ASYNCMEMORYBANK2ASYNCMEMORYBANK1ASYNCMEMORYBANK0RESERVEDSDRAMBANK3SDRAMBANK2SDRAMBANK10x00000000SDRAMBANK0EXTERNALMEMORY0xFF8000000xFF7010000xFF7000000xFF6140000xFF6100000xFF6040000xFF6000000xFF5080000xFF5040000xFF5000000xFF4080000xFF4040000xFF400000INTERNALMEMORYRESERVEDCOREMMRREGISTERSCOREMMRREGISTERSSYSTEMMMRREGISTERSCOREBMEMORYMAPADSP-BF561
Figure 3.Memory Map
The fourth on-chip memory system is the L2 SRAM memory
array which provides 128K bytes of high speed SRAM operating at one half the bandwidth of the core, and slightly longer latency than the L1 memory banks. The L2 memory is a unified instruc-tion and data memory and can hold any mixture of code and data required by the system design. The Blackfin cores share a dedicated low-latency -bit wide data path port into the L2 SRAM memory.
Each Blackfin core processor has its own set of core Memory Mapped Registers (MMRs) but share the same system MMR registers and 128 KB L2 SRAM memory.
(SDRAM) as well as up to four banks of asynchronous memory devices including flash, EPROM, ROM, SRAM, and memory mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed to interface to up to four banks of SDRAM, with each bank con-taining between 16M bytes and 128M bytes providing access to up to 512M bytes of SDRAM. Each bank is independently pro-grammable and is contiguous with adjacent banks regardless of the sizes of the different banks or their placement. This allows flexible configuration and upgradability of system memory while allowing the core to view all SDRAM as a single, contigu-ous, physical address space.
The asynchronous memory controller can also be programmed to control up to four banks of devices with very flexible timing parameters for a wide variety of devices. Each bank occupies a
External (Off-Chip) Memory
The ADSP-BF561 external memory is accessed via the External Bus Interface Unit (EBIU). This interface provides a glueless connection to up to four banks of synchronous DRAM
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ADSP-BF561
M-byte segment regardless of the size of the devices used so that these banks will only be contiguous if fully populated with M bytes of memory.
Preliminary Technical Data
The ADSP-BF561 event controller consists of two stages, the Core Event Controller (CEC) and the System Interrupt Control-ler (SIC). The Core Event Controller works with the System Interrupt Controller to prioritize and control all system events. Conceptually, interrupts from the peripherals enter into the SIC, and are then routed directly into the general-purpose inter-rupts of the CEC.
I/O Memory Space
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space. On-chip I/O devices have their control registers mapped into mem-ory-mapped registers (MMRs) at addresses near the top of the 4G-byte address space. These are separated into two smaller blocks, one which contains the control MMRs for all core func-tions, and the other which contains the registers needed for setup and control of the on-chip peripherals outside of the core. The core MMRs are accessible only by the core and only in supervisor mode and appear as reserved space by on-chip peripherals. The system MMRs are accessible by the core in supervisor mode and can be mapped as either visible or reserved to other devices, depending on the system protection model desired.
Core Event Controller (CEC)
The CEC supports nine general-purpose interrupts (IVG15–7), in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest-priority inter-rupts (IVG15–14) are recommended to be reserved for software interrupt handlers, leaving seven prioritized interrupt inputs to support the peripherals of the ADSP-BF561. Table1 describes the inputs to the CEC, identifies their names in the Event Vector
Table (EVT), and lists their priorities.Table 1.Core Event Controller (CEC)
Priority
(0 is Highest)01234567101112131415
Event Class
EVT Entry
Booting
The ADSP-BF561 contains a small boot kernel, which config-ures the appropriate peripheral for booting. If the ADSP-BF561 is configured to boot from boot ROM memory space, the pro-cessor starts executing from the on-chip boot ROM.
Event Handling
The event controller on the ADSP-BF561 handles all asynchro-nous and synchronous events to the processor. The ADSP-BF561 provides event handling that supports both nesting and prioritization. Nesting allows multiple event service routines to be active simultaneously. Prioritization ensures that servicing of a higher-priority event takes precedence over servicing of a lower-priority event. The controller provides support for five different types of events:
•Emulation – An emulation event causes the processor to enter emulation mode, allowing command and control of the processor via the JTAG interface.•Reset – This event resets the processor.
•Non-Maskable Interrupt (NMI) – The NMI event can be generated by the software watchdog timer or by the NMI input signal to the processor. The NMI event is frequently used as a power-down indicator to initiate an orderly shut down of the system.
•Exceptions – Events that occur synchronously to program flow, i.e., the exception will be taken before the instruction is allowed to complete. Conditions such as data alignment violations, undefined instructions, etc. cause exceptions.•Interrupts – Events that occur asynchronously to program flow. They are caused by timers, peripherals, input pins, and an explicit software instruction.
Each event has an associated register to hold the return address and an associated return-from-event instruction. When an event is triggered, the state of the processor is saved on the supervisor stack.
Emulation/TestEMUResetRSTNon-Maskable NMIExceptionsEVXGlobal Enable-Hardware ErrorIVHWCoreTimerIVTMRGeneral Interrupt 7IVG7General Interrupt 8IVG8General Interrupt 9IVG9General Interrupt 10IVG10General Interrupt 11IVG11General Interrupt 12IVG12General Interrupt 13IVG13General Interrupt 14IVG14General Interrupt 15IVG15
System Interrupt Controller (SIC)
The System Interrupt Controller provides the mapping and
routing of events from the many peripheral interrupt sources, to the prioritized general-purpose interrupt inputs of the CEC. Although the ADSP-BF561 provides a default mapping, the user can alter the mappings and priorities of interrupt events by writ-ing the appropriate values into the Interrupt Assignment Registers (IAR). Table2 describes the inputs into the SIC and the default mappings into the CEC.
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Preliminary Technical Data
Table 2.Peripheral Interrupt Source Reset State
Peripheral Interrupt SourcePLL wakeupDMA1 ErrorDMA2 ErrorIMDMA ErrorPPI1 ErrorPPI2 ErrorSPORT0 ErrorSPORT1 ErrorSPI ErrorUART ErrorReserved
DMA1 0 interruptDMA1 1 interruptDMA1 2 interruptDMA1 3 interruptDMA1 4 interruptDMA1 5 interruptDMA1 6 interruptDMA1 7 interruptDMA1 8 interruptDMA1 9 interruptDMA1 10 interruptDMA1 11 interruptDMA2 0 interruptDMA2 1 interruptDMA2 2 interruptDMA2 3 interruptDMA2 4 interruptDMA2 5 interruptDMA2 6 interruptDMA2 7 interruptDMA2 8 interruptDMA2 9 interruptDMA2 10 interruptDMA2 11 interruptTimer0 interruptTimer1 interruptTimer2 interruptTimer3 interruptTimer4 interruptTimer5 interruptTimer6 interruptTimer7 interruptTimer8 interruptTimer9 interruptTimer10 interrupt
Chan101234567101112131415161718192021222324252627282930313233343536373839404142434445
IVG2 IVG07IVG07IVG07IVG07IVG07IVG07IVG07IVG07IVG07IVG07IVG07IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG08IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG09IVG10IVG10IVG10IVG10IVG10IVG10IVG10IVG10IVG10IVG10IVG10
Peripheral Interrupt SourceTimer11 interruptFIO0 interrupt AFIO0 interrupt BFIO1 interrupt AFIO1 interrupt BFIO2 interrupt AFIO2 interrupt B
DMA1 write/read 0 interruptDMA1 write/read1 interruptDMA2 write/read 0 interruptDMA2 write/read 1 interruptIMDMA write/read 0 interruptIMDMA write/read 1 interruptWatchdog TimerReservedReserved
Supplemental 0Supplemental 1
12ADSP-BF561
Table 2.Peripheral Interrupt Source Reset State (Continued)
Chan147484950515253555657585960616263
IVG2 IVG10IVG11IVG11IVG11IVG11IVG11IVG11IVG08IVG08IVG09IVG09IVG12IVG12IVG13IVG07IVG07IVG07IVG07
Peripheral Interrupt Channel NumberDefault User IVG Interrupt
Event Control
The ADSP-BF561 provides the user with a very flexible mecha-nism to control the processing of events. In the CEC, three registers are used to coordinate and control events. Each of the registers, as follows, is 16-bits wide, while each bit represents a particular event class:
•CEC Interrupt Latch Register (ILAT) – The ILAT register indicates when events have been latched. The appropriate bit is set when the processor has latched the event and cleared when the event has been accepted into the system. This register is updated automatically by the controller, but may be written only when its corresponding IMASK bit is cleared.
•CEC Interrupt Mask Register (IMASK) – The IMASK reg-ister controls the masking and unmasking of individual events. When a bit is set in the IMASK register, that event is unmasked and will be processed by the CEC when asserted. A cleared bit in the IMASK register masks the event
thereby preventing the processor from servicing the event even though the event may be latched in the ILAT register. This register may be read from or written to while in super-visor mode. (Note that general-purpose interrupts can be globally enabled and disabled with the STI and CLI instruc-tions, respectively.)
•CEC Interrupt Pending Register (IPEND) – The IPEND register keeps track of all nested events. A set bit in the IPEND register indicates the event is currently active or nested at some level. This register is updated automatically by the controller but may be read while in supervisor mode.
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ADSP-BF561
The SIC allows further control of event processing by providing six 32-bit interrupt control and status registers. Each register contains a bit corresponding to each of the peripheral interrupt events shown in Table2.
•SIC Interrupt Mask Register (SIC_IMASK0, SIC_IMASK1) – This register controls the masking and unmasking of each peripheral interrupt event. When a bit is set in the reg-ister, that peripheral event is unmasked and will be
processed by the system when asserted. A cleared bit in the register masks the peripheral event thereby preventing the processor from servicing the event.
•SIC Interrupt Status Register (SIC_ISTAT0, SIC_ISTAT1) – As multiple peripherals can be mapped to a single event, this register allows the software to determine which periph-eral event source triggered the interrupt. A set bit indicates the peripheral is asserting the interrupt, a cleared bit indi-cates the peripheral is not asserting the event.
•SIC Interrupt Wakeup Enable Register (SIC_IWR0,
SIC_IWR1)– By enabling the corresponding bit in this reg-ister, each peripheral can be configured to wake up the processor, should the processor be in a powered down mode when the event is generated. (For more information, see Dynamic Power Management on Page11.)
Because multiple interrupt sources can map to a single general-purpose interrupt, multiple pulse assertions can occur simulta-neously, before or during interrupt processing for an interrupt event already detected on this interrupt input. The IPEND reg-ister contents are monitored by the SIC as the interrupt acknowledgement.
The appropriate ILAT register bit is set when an interrupt rising edge is detected (detection requires two core clock cycles). The bit is cleared when the respective IPEND register bit is set. The IPEND bit indicates that the event has entered into the proces-sor pipeline. At this point the CEC will recognize and queue the next rising edge event on the corresponding event input. The minimum latency from the rising edge transition of the general-purpose interrupt to the IPEND output asserted is three core clock cycles; however, the latency can be much higher, depend-ing on the activity within and the mode of the processor.
Preliminary Technical Data
The 2D DMA capability supports arbitrary row and column sizes up to K elements by K elements, and arbitrary row and column step sizes up to +/- 32K elements. Furthermore, the column step size can be less than the row step size, allowing implementation of interleaved data streams. This feature is especially useful in video applications where data can be de-interleaved on the fly.
Examples of DMA types supported by the ADSP-BF561 DMA controllers include:
•A single, linear buffer that stops upon completion•A circular, auto-refreshing buffer that interrupts on each full or fractionally full buffer
•1-D or 2-D DMA using a linked list of descriptors•2-D DMA using an array of descriptors, specifying only the base DMA address within a common page
In addition to the dedicated peripheral DMA channels, each DMA Controller has four memory DMA channels provided for transfers between the various memories of the ADSP-BF561 system. These enable transfers of blocks of data between any of the memories—including external SDRAM, ROM, SRAM, and flash memory—with minimal processor intervention. Memory DMA transfers can be controlled by a very flexible descriptor-based methodology or by a standard register-based autobuffer mechanism.
Further, the ADSP-BF561 has a four channel Internal Memory DMA (IMDMA) Controller. The IMDMA Controller allows data transfers between any of the internal L1 and L2 memories.
WATCHDOG TIMERS
Each ADSP-BF561 core includes a 32-bit timer, which can be used to implement a software watchdog function. A software watchdog can improve system availability by forcing the proces-sor to a known state, via generation of a hardware reset, non-maskable interrupt (NMI), or general- purpose interrupt, if the timer expires before being reset by software. The programmer initializes the count value of the timer, enables the appropriate interrupt, then enables the timer. Thereafter, the software must reload the counter before it counts to zero from the pro-grammed value. This protects the system from remaining in an unknown state where software, which would normally reset the timer, has stopped running due to an external noise condition or software error.
After a reset, software can determine if the watchdog was the source of the hardware reset by interrogating a status bit in the timer control register, which is set only upon a watchdog gener-ated reset.
The timer is clocked by the system clock (SCLK), at a maximum frequency of SCLK.
DMA CONTROLLERS
The ADSP-BF561 has multiple, independent DMA controllers that support automated data transfers with minimal overhead for the DSP core. DMA transfers can occur between the ADSP-BF561's internal memories and any of its DMA-capable periph-erals. Additionally, DMA transfers can be accomplished between any of the DMA-capable peripherals and external devices connected to the external memory interfaces, including the SDRAM controller and the asynchronous memory control-ler. DMA-capable peripherals include the SPORTs, SPI port, UART, and PPI. Each individual DMA-capable peripheral has at least one dedicated DMA channel.
The ADSP-BF561 DMA controllers support both 1-dimen-sional (1D) and 2-dimensional (2D) DMA transfers. DMA transfer initialization can be implemented from registers or from sets of parameters called descriptor blocks.
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Preliminary Technical Data
SERIAL PORTS (SPORTS)
The ADSP-BF561 incorporates two dual-channel synchronous serial ports (SPORT0 and SPORT1) for serial and multiproces-sor communications. The SPORTs support the following features:
•I2S capable operation.
•Bidirectional operation – Each SPORT has two sets of inde-pendent transmit and receive pins, enabling eight channels of I2S stereo audio.
•Buffered (8-deep) transmit and receive ports – Each port has a data register for transferring data words to and from other DSP components and shift registers for shifting data in and out of the data registers.
•Clocking – Each transmit and receive port can either use an external serial clock or generate its own, in frequencies ranging from (fSCLK/131,070)Hz to (fSCLK/2)Hz.
•Word length – Each SPORT supports serial data words from 3 to 32bits in length, transferred most-significant-bit first or least-significant-bit first.
•Framing – Each transmit and receive port can run with or without frame sync signals for each data word. Frame sync signals can be generated internally or externally, active high or low, and with either of two pulsewidths and early or late frame sync.
•Companding in hardware – Each SPORT can perform A-law or µ-law companding according to ITU recommen-dation G.711. Companding can be selected on the transmit and/or receive channel of the SPORT without additional latencies.
•DMA operations with single-cycle overhead – Each SPORT can automatically receive and transmit multiple buffers of memory data. The DSP can link or chain sequences of DMA transfers between a SPORT and memory.•Interrupts – Each transmit and receive port generates an interrupt upon completing the transfer of a data word or after transferring an entire data buffer or buffers through DMA.
•Multichannel capability – Each SPORT supports 128 chan-nels out of a 1024-channel window and is compatible with the H.100, H.110, MVIP-90, and HMVIP standards.
ADSP-BF561
provide a full duplex, synchronous serial interface, which sup-ports both master and slave modes and multimaster environments.
Each SPI port’s baud rate and clock phase/polarities are pro-grammable (see SPI Clock Rate equation), and each has an integrated DMA controller, configurable to support transmit or receive data streams. The SPI’s DMA controller can only service unidirectional accesses at any given time.
f
--------------------SPI Clock Rate=--------------SCLK
2×SPIBAUD
During transfers, the SPI ports simultaneously transmit and receive by serially shifting data in and out on their two serial data lines. The serial clock line synchronizes the shifting and sampling of data on the two serial data lines.
UART PORT
The ADSP-BF561 provides a full duplex Universal Asynchro-nous Receiver/Transmitter (UART) ports (UART0 and
UART1) fully compatible with PC-standard UARTs. The UART ports provide a simplified UART interface to other peripherals or hosts, supporting full duplex, DMA supported, asynchronous transfers of serial data. Each UART port includes support for 5 to 8data bits; 1 or 2stop bits; and none, even, or odd parity. The UART ports support two modes of operation, as follows:•PIO (Programmed I/O) – The processor sends or receives data by writing or reading I/O-mapped UATX or UARX registers, respectively. The data is double-buffered on both transmit and receive.
•DMA (Direct Memory Access) – The DMA controller transfers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer data to and from memory. Each UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower priority than most DMA chan-nels because of their relatively low service rates.
Each UART port’s baud rate (see UART Clock Rate equation), serial data format, error code generation and status, and inter-rupts are programmable. In the UART Clock Rate equation, the divisor (D) can be 1 to 65536.
fSCLK
UART Clock Rate=---------------16×D
The UART programmable features include:
•Supporting bit rates ranging from (fSCLK/ 1048576) to (fSCLK/16) bits per second.
•Supporting data formats from 7 to12bits per frame.•Both transmit and receive operations can be configured to generate maskable interrupts to the processor.
In conjunction with the general-purpose timer functions, auto-baud detection is supported.
SERIAL PERIPHERAL INTERFACE (SPI) PORTS
The ADSP-BF561 has one SPI-compatible ports that enable the processor to communicate with multiple SPI-compatible devices.
The SPI interface uses three pins for transferring data: two data pins (Master Output-Slave Input, MOSIx, and Master Input-Slave Output, MISO) and a clock pin (Serial Clock, SCK). One SPI chip select input pin (SPISS) let other SPI devices select the DSP, and seven SPI chip select output pins (SPISEL7–1) let the DSP select other SPI devices. The SPI select pins are reconfig-ured Programmable Flag pins. Using these pins, the SPI ports
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ADSP-BF561
The capabilities of UART0 are further extended with support for the InfraRed Data Association (IrDA®) Serial InfraRed Phys-ical Layer Link Specification (SIR) protocol.
Preliminary Technical Data
addition to the twelve general-purpose programmable timers, another timer is also provided for each core. These extra timers are clocked by the internal processor clock (CCLK) and is typi-cally used as a system tick clock for generation of operating
system periodic interrupts.
PROGRAMMABLE FLAGS (PFX)
The ADSP-BF561 has 48 bi-directional, general-purpose I/O,
Programmable Flag (PF47–0) pins. The Programmable Flag pins have special functions for SPI port operation. Each pro-grammable flag can be individually controlled as follows by manipulation of the flag control, status, and interrupt registers:•Flag Direction Control Register – Specifies the direction of each individual PFx pin as input or output.
•Flag Control and Status Registers – Rather than forcing the software to use a read-modify-write process to control the setting of individual flags, the ADSP-BF561 employs a \"write one to set\" and \"write one to clear\" mechanism that allows any combination of individual flags to be set or cleared in a single instruction, without affecting the level of any other flags. Two control registers are provided, one register is written to in order to set flag values while
another register is written to in order to clear flag values. Reading the flag status register allows software to interro-gate the sense of the flags.
•Flag Interrupt Mask Registers – The Flag Interrupt Mask Registers allow each individual PFx pin to function as an interrupt to the processor. Similar to the Flag Control Reg-isters that are used to set and clear individual flag values, one Flag Interrupt Mask Register sets bits to enable inter-rupt function, and the other Flag Interrupt Mask register clears bits to disable interrupt function. PFx pins defined as inputs can be configured to generate hardware interrupts, while output PFx pins can be configured to generate soft-ware interrupts.
•Flag Interrupt Sensitivity Registers – The Flag Interrupt Sensitivity Registers specify whether individual PFx pins are level- or edge-sensitive and specify-if edge-sensitive-whether just the rising edge or both the rising and falling edges of the signal are significant. One register selects the type of sensitivity, and one register selects which edges are significant for edge-sensitivity.
PARALLEL PERIPHERAL INTERFACE
The processor provides two Parallel Peripheral Interfaces (PPI) that can connect directly to parallel A/D and D/A converters, ITU-R-601/656 video encoders and decoders, and other general purpose peripherals. Each PPI consists of a dedicated input clock pin, up to 3 frame synchronization pins, and up to 16 data pins.
In ITU-R 656 mode, the PPI receives and parses a data stream of 8- bit or 10-bit data elements. On-chip decode of embedded preamble control and synchronization information is supported.
General Purpose Mode Descriptions
The general-purpose modes of the PPI are intended to suit a wide variety of data capture and transmission applications. The modes are divided into four main categories, each allowing up to 16 bits of data transfer per PPI_CLK cycle:
•Data Receive with Internally Generated Frame Syncs.•Data Receive with Externally Generated Frame Syncs.•Data Transmit with Internally Generated Frame Syncs.•Data Transmit with Externally Generated Frame Syncs.
Input Mode
These modes support ADC/DAC connections, as well as video communication with hardware signaling. Many of the modes support more than one level of frame synchronization. If desired, a programmable delay can be inserted between asser-tion of a frame sync and reception / transmission of data.
ITU -R 656 Mode Descriptions
Three distinct ITU-R 656 modes are supported:•ActiveVideoOnlyMode•Vertical Blanking Only Mode•Entire Field Mode
TIMERS
There are fourteen (14) programmable timer units in the ADSP-BF561. Twelve general-purpose timers have an external pin that can be configured either as a Pulse Width Modulator (PWM) or timer output, as an input to lock the timer, or for measuring pulse widths of external events. Each of the twelve general-pur-pose timer units can be independently programmed as a PWM, internally or externally clocked timer, or pulse width counter. The general-purpose timer units can be used in conjunction with the UART to measure the width of the pulses in the data stream to provide an auto-baud detect function for a serial channel.
The general-purpose timers can generate interrupts to the pro-cessor core providing periodic events for synchronization,
either to the processor clock or to a count of external signals. In
Active Video Only Mode
In this mode, the PPI does not read in any data between the End of Active Video (EAV) and Start of Active Video (SAV) pream-ble symbols, or any data present during the vertical blanking intervals. In this mode, the control byte sequences are not stored to memory; they are filtered by the PPI.
Vertical Blanking Interval Mode
In this mode, the PPI only transfers vertical blanking interval (VBI) data, as well as horizontal blanking information and con-trol byte sequences on VBI lines.
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Preliminary Technical Data
Entire Field Mode
In this mode, the entire incoming bitstream is read in through the PPI. This includes active video, control preamble sequences, and ancillary data that may be embedded in horizontal and ver-tical blanking intervals.
Though not explicitly supported, ITU,-656 output functionality can be achieved by setting up the entire frame structure (includ-ing active video, blanking and control information) in memory and streaming the data out of the PPI in a frame sync-less mode. The processor’s 2D DMA features facilitate this transfer by allowing the static frame buffer (blanking and control codes) to be placed in memory once, and simply updating the active video information on per-frame basis.
These modes support ADC/DAC connections, as well as video communication with hardware signaling. Many of the modes support more than one level of frame synchronization. If desired, a programmable delay can be inserted between asser-tion of a frame sync and reception/transmission of data.
Table 3.Power Settings (Continued)
Mode
PLL
ADSP-BF561
PLLCoreBypassedClock
(CCLK)
SleepEnabled–DisabledDeep SleepDisabled–DisabledHibernateDisabled–Disabled
System
Clock(SCLK)EnabledDisabledDisabled
Core PowerOnOnOff
Hibernate Operating Mode—Maximum Static Power Savings
The Hibernate mode maximizes static power savings by dis-abling the voltage and clocks to the processor core (CCLK) and to all the synchronous peripherals (SCLK). The internal voltage regulator for the processor can be shut off by writing b#00 to the FREQ bits of the VR_CTL register. This disables both CCLK and SCLK. Furthermore, it sets the internal power supply volt-age (VDDINT) to 0 V to provide the lowest static power
dissipation. Any critical information stored internally (memory contents, register contents, etc.) must be written to a non-vola-tile storage device prior to removing power if the processor state is to be preserved. Since VDDEXT is still supplied in this mode, all of the external pins tri-state, unless otherwise specified. This allows other devices that may be connected to the processor to have power still applied without drawing unwanted current. The internal supply regulator can be woken up by asserting the RESET pin.DYNAMIC POWER MANAGEMENT
The ADSP-BF561 provides four operating modes, each with a different performance/power profile. In addition, Dynamic Power Management provides the control functions to dynami-cally alter the processor core supply voltage, further reducing power dissipation. Control of clocking to each of the ADSP-BF561 peripherals also reduces power consumption. See Table3 for a summary of the power settings for each mode.
Full-On Operating Mode – Maximum PerformanceIn the Full-On mode, the PLL is enabled and is not bypassed, providing capability for maximum operational frequency. This is the default execution state in which maximum performance can be achieved. The processor cores and all enabled peripherals run at full speed.
Sleep Operating Mode—High Dynamic Power SavingsThe Sleep mode reduces power dissipation by disabling the clock to the processor core (CCLK). The PLL and system clock (SCLK), however, continue to operate in this mode. Typically an external event will wake up the processor. When in the Sleep mode, assertion of wakeup will cause the processor to sense the value of the BYPASS bit in the PLL Control register (PLL_CTL).When in the Sleep mode, system DMA access to L1 memory is not supported.
Active Operating Mode – Moderate Power SavingsIn the Active mode, the PLL is enabled but bypassed. Because the PLL is bypassed, the processor’s core clock (CCLK) and sys-tem clock (SCLK) run at the input clock (CLKIN) frequency. In this mode, the CLKIN to CCLK multiplier ratio can be changed, although the changes are not realized until the Full-On mode is entered. DMA access is available to appropriately configured L1 memories.
In the Active mode, it is possible to disable the PLL through the PLL Control register (PLL_CTL). If disabled, the PLL must be re-enabled before transitioning to the Full-On or Sleep modes.Table 3.Power Settings
Mode
PLLCoreBypassedClock
(CCLK)
EnabledNoEnabledEnabled/YesEnabledDisabledPLL
SystemClock(SCLK)EnabledEnabled
Core PowerOnOn
Deep Sleep Operating Mode—Maximum Dynamic Power Savings
The Deep Sleep mode maximizes power savings by disabling the clocks to the processor cores (CCLK) and to all synchronous peripherals (SCLK). Asynchronous peripherals will not be able to access internal resources or external memory. This powered-down mode can only be exited by assertion of the reset interrupt (RESET). If BYPASS is disabled, the processor will transition to the Full On mode. If BYPASS is enabled, the processor will tran-sition to the Active mode.
Power Savings
As shown in Table4, the ADSP-BF561 supports two different power domains. The use of multiple power domains maximizes flexibility, while maintaining compliance with industry stan-dards and conventions. By isolating the internal logic of the ADSP-BF561 into its own power domain, separate from the I/O,
Full OnActive
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ADSP-BF561
the processor can take advantage of Dynamic Power Manage-ment, without affecting the I/O devices. There are no sequencing requirements for the various power domains. Table 4.ADSP-BF561 Power Domains
Power DomainAll internal logicI/O
VDD RangeVDDINTVDDEXTPreliminary Technical Data
The Power Savings Factor is calculated as:
Power Savings Factor
fCCLKRED⎛VDDINTRED⎞2⎛TRED⎞
-×--------------------------×------------=--------------------⎝TNOM⎠fCCLKNOM⎝VDDINTNOM⎠
where the variables in the equations are:
•fCCLKNOM is the nominal core clock frequency •fCCLKRED is the reduced core clock frequency•VDDINTNOM is the nominal internal supply voltage •VDDINTRED is the reduced internal supply voltage•TNOM is the duration running at fCCLKNOM•TRED is the duration running at fCCLKREDThe percent power savings is calculated as:
% Power Savings=(1–Power Savings Factor)×100%
The power dissipated by a processor is largely a function of the
clock frequency of the processor and the square of the operating voltage. For example, reducing the clock frequency by 25% results in a 25% reduction in dynamic power dissipation, while reducing the voltage by 25% reduces dynamic power dissipation by more than 40%. Further, these power savings are additive, in that if the clock frequency and supply voltage are both reduced, the power savings can be dramatic.
The Dynamic Power Management feature of the ADSP-BF561 allows both the processor’s input voltage (VDDINT) and clock frequency (fCCLK) to be dynamically controlled.
The savings in power dissipation can be modeled using the Power Savings Factor and %Power Savings calculations.
VOLTAGE REGULATION
The ADSP-BF561 processor provides an on-chip voltage regula-tor that can generate processor core voltage levels 0.85V(-5% / +10%) to 1.2V(-5% / +10%) from an external 2.25V to 3.6V supply. Figure4 shows the typical external components
required to complete the power management system. The regu-lator controls the internal logic voltage levels and is
programmable with the Voltage Regulator Control Register (VR_CTL) in increments of 50mV. To reduce standby power consumption, the internal voltage regulator can be programmed to remove power to the processor core while keeping I/O power (VDDEXT) supplied. While in hibernation, VDDEXT can still be applied, eliminating the need for external buffers. The voltage regulator can be activated from this powerdown state by assert-ing RESET, which will then initiate a boot sequence. The regulator can also be disabled and bypassed at the user’s discretion.
Figure 4.Voltage Regulator Circuit
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Preliminary Technical Data
CLOCK SIGNALS
The ADSP-BF561 can be clocked by an external crystal, a sine wave input, or a buffered, shaped clock derived from an external clock oscillator.
If an external clock is used, it should be a TTL compatible signal and must not be halted, changed, or operated below the speci-fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external clock is used, the XTAL pin must be left unconnected.Alternatively, because the ADSP-BF561 includes an on-chip oscillator circuit, an external crystal may be used. The crystal should be connected across the CLKIN and XTAL pins, with two capacitors connected as shown in Figure5
Capacitor values are dependent on crystal type and should be specified by the crystal manufacturer. A parallel-resonant, fun-damental frequency, microprocessor-grade crystal should be used.
ADSP-BF561
into the SSEL fields define a divide ratio between the PLL output (VCO) and the system clock. SCLK divider values are 1 through 15. Table5 illustrates typical system clock ratios:Table 5.Example System Clock Ratios
Signal Name Divider Ratio Example Frequency Ratios SSEL[3–0]VCO/SCLK(MHz)
VCOSCLK
00011:110010001106:130050101010:150050
The maximum frequency of the system clock is fSCLK. Note that the divisor ratio must be chosen to limit the system clock fre-quency to its maximum of fSCLK. The SSEL value can be changed dynamically without any PLL lock latencies by writing the appropriate values to the PLL divisor register (PLL_DIV).The core clock (CCLK) frequency can also be dynamically changed by means of the CSEL[1–0] bits of the PLL_DIV regis-ter. Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in Table6. This programmable core clock capability is useful for fast core frequency modifications.Table 6.Core Clock Ratios
Signal Name Divider Ratio Example Frequency Ratios CSEL[1–0]VCO/CCLKVCOCCLK001:1500500012:1500250104:120050118:120025
CLKINXTALCLKOUTFigure 5.External Crystal Connections
As shown in Figure6, the core clock (CCLK) and system
peripheral clock (SCLK) are derived from the input clock (CLKIN) signal. An on-chip PLL is capable of multiplying the CLKIN signal by a user programmable 1x to 63x multiplication factor. The default multiplier is 10x, but it can be modified by a software instruction sequence. On-the-fly frequency changes can be effected by simply writing to the PLL_DIV register.
BOOTING MODES
The ADSP-BF561 has three mechanisms (listed in Table7) for automatically loading internal L1 instruction memory after a reset. A fourth mode is provided to execute from external mem-ory, bypassing the boot sequence.Table 7.Booting Modes
BMODE1–000011011
Description
Execute from 16-bit external memory (Bypass Boot ROM)
Boot from 8/16-bit flashReserved
Boot from SPI serial ROM (16-bit address range)
“FINE”ADJUSTMENTREQUIRESPLLSEQUENCING“COARSE”ADJUSTMENTON-THE-FLY×1,2,4,8CLKINPLL1×-63×VCO×1:15CCLKSCLKSCLK≤CCLKSCLK≤133MHZFigure 6.Frequency Modification Methods
All on-chip peripherals are clocked by the system clock (SCLK). The system clock frequency is programmable by means of the SSEL3–0 bits of the PLL_DIV register. The values programmed
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ADSP-BF561
The BMODE pins of the Reset Configuration Register, sampled during power-on resets and software-initiated resets, imple-ment the following modes:
•Execute from 16-bit external memory - Execution starts from address 0x2000 0000 with 16-bit packing. The boot ROM is bypassed in this mode. All configuration settings are set for the slowest device possible (3-cycle hold time, 15-cycle R/W access times, 4-cycle setup).
•Boot from 8/16-bit external FLASH memory – The 8/16-bit FLASH boot routine located in boot ROM memory space is set up using Asynchronous Memory Bank 0. All configura-tion settings are set for the slowest device possible (3-cycle hold time; 15-cycle R/W access times; 4-cycle setup).•Boot from SPI serial EEPROM (16-bit addressable) – The SPI uses the PF2 output pin to select a single SPI EPROM device, submits a read command at address 0x0000, and begins clocking data into the beginning of L1 instruction memory. A 16-bit addressable SPI-compatible EPROM must be used.
For each of the boot modes, a boot loading protocol is used to transfer program and data blocks, from an external memory device, to their specified memory locations. Multiple memory blocks may be loaded by any boot sequence. Once all blocks are loaded, Core A program execution commences from the start of L1 instruction SRAM (0xFFA0 0000). Core B remains in a held-off state until a certain register bit is cleared. After that, Core B will start execution at address 0xFF60 0000.
In addition, bit 4 of the Reset Configuration Register can be set by application code to bypass the normal boot sequence during a software reset. For this case, the processor jumps directly to the beginning of L1 instruction memory.
Preliminary Technical Data
•All registers, I/O, and memory are mapped into a unified 4G-byte memory space providing a simplified program-ming model.
•Microcontroller features, such as arbitrary bit and bit-field manipulation, insertion, and extraction; integer operations on 8-, 16-, and 32-bit data-types; and separate user and ker-nel stack pointers.
•Code density enhancements, which include intermixing of 16- and 32-bit instructions (no mode switching, no code segregation). Frequently used instructions are encoded as 16-bits.
DEVELOPMENT TOOLS
The ADSP-BF561 is supported with a complete set of
CROSSCORETM software and hardware development tools, including Analog Devices emulators and the VisualDSP++® development environment. The same emulator hardware that supports other Analog Devices processors also fully emulates the ADSP-BF561.
The VisualDSP++ project management environment lets pro-grammers develop and debug an application. This environment includes an easy-to-use assembler that is based on an algebraic syntax, an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ run-time library that includes DSP and mathemat-ical functions. A key point for these tools is C/C++ code
efficiency. The compiler has been developed for efficient trans-lation of C/C++ code to Blackfin assembly. The Blackfin
processor has architectural features that improve the efficiency of compiled C/C++code.
The VisualDSP++ debugger has a number of important fea-tures. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representa-tion of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in com-plexity, this capability can have increasing significance on the designer’s development schedule, increasing productivity. Sta-tistical profiling enables the programmer to non intrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to passively gather important code execution metrics without interrupting the real-time characteristics of the program. Essentially, the developer can identify bottlenecks in software quickly and effi-ciently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action.
Debugging both C/C++ and assembly programs with the Visu-alDSP++ debugger, programmers can:
•View mixed C/C++ and assembly code (interleaved source and object information)•Insert breakpoints
•Set conditional breakpoints on registers, memory, and stacks
•Trace instruction execution
•Perform linear or statistical profiling of program execution
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set employs an algebraic syntax that was designed for ease of coding and readability. The instructions have been specifically tuned to provide a flexible, densely encoded instruction set that compiles to a very small final memory size. The instruction set also pro-vides fully featured multifunction instructions that allow the programmer to use many of the processor core resources in a single instruction. Coupled with many features more often seen on microcontrollers, this instruction set is very efficient when compiling C and C++ source code. In addition, the architecture supports both a user (algorithm/application code) and a super-visor (O/S kernel, device drivers, debuggers, ISRs) mode of operations, allowing multiple levels of access to core processor resources.
The assembly language, which takes advantage of the proces-sor’s unique architecture, offers the following advantages:•Seamlessly integrated DSP/CPU features are optimized for both 8-bit and 16-bit operations.
•A multi-issue load/store modified-Harvard architecture, which supports two 16-bit MAC or four 8-bit ALU + two load/store + two pointer updates per cycle.
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Preliminary Technical Data
•Fill, dump, and graphically plot the contents of memory•Perform source level debugging•Create custom debugger windows
The VisualDSP++ IDE lets programmers define and manage software development. Its dialog boxes and property pages let programmers configure and manage all development tools, including Color Syntax Highlighting in the VisualDSP++ edi-tor. These capabilities permit programmers to:
•Control how the development tools process inputs and generate outputs.
•Maintain a one-to-one correspondence with the tool’s command line switches.
The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the mem-ory and timing constraints of embedded, real-time
programming. These capabilities enable engineers to develop code more effectively, eliminating the need to start from the very beginning, when Developing new application code. The VDK features include Threads, Critical and Unscheduled regions, Semaphores, Events, and Device flags. The VDK also supports Priority-based, Pre-emptive, Cooperative and Time-Sliced scheduling approaches. In addition, the VDK was
designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used with standard command-line tools. When the VDK is used, the development environment assists the developer with many error-prone tasks and assists in managing system resources, automating the gen-eration of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.VCSE is Analog Devices technology for creating, using, and reusing software components (independent modules of sub-stantial functionality) to quickly and reliably assemble software applications. Download components from the Web and drop them into the application. Publish component archives from within VisualDSP++. VCSE supports component implementa-tion in C/C++ or assembly language.
Use the Expert Linker to visually manipulate the placement of code and data on the embedded system. View memory utiliza-tion in a color-coded graphical form, easily move code and data to different areas of the processor or external memory with the drag of the mouse, examine run time stack and heap usage. The Expert Linker is fully compatible with existing Linker Definition File (LDF), allowing the developer to move between the graphi-cal and textual environments.
Analog Devices’ emulators use the IEEE 1149.1 JTAG test access port of the ADSP-BF561 to monitor and control the target board processor during emulation. The emulator provides full-speed emulation, allowing inspection and modification of mem-ory, registers, and processor stacks. Non intrusive in-circuit
ADSP-BF561
emulation is assured by the use of the processor’s JTAG inter-face—the emulator does not affect target system loading or timing.
In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the Blackfin processor family. Third Party software tools include DSP libraries, real-time operating systems, and block diagram design tools.
DESIGNING AN EMULATOR-COMPATIBLEPROCESSOR BOARD (TARGET)
The Analog Devices family of emulators are tools that every sys-tem developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on the ADSP-BF561. The emulator uses the TAP to access the internal features of the processor, allow-ing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces-sor must be halted to send data and commands, but once an operation has been completed by the emulator, the processor is set running at full speed with no impact on system timing.To use these emulators, the target board must include a header that connects the processor’s JTAG port to the emulator.For details on target board design issues including mechanical layout, single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices web site (www.analog.com)—use site search on “EE-68.” This document is updated regularly to keep pace withimprovements to emulator support.To use these emulators, the target board must include a header that includes a header that connects the processor’s JTAG port to the emulation.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-BF561 architecture and functionality. For detailed information on the Blackfin DSP family core architecture and instruction set, refer to the ADSP-BF561 Hardware Reference and the Blackfin Family Instruction Set Reference.
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ADSP-BF561
PIN DESCRIPTIONS
ADSP-BF561 pin definitions are listed in Table8. Unused inputs should be tied or pulled to VDDEXT or GND. Table 8.Pin Descriptions
BlockEBIU
Pin NameADDR[25:2]DATA[31:0]
ABE[3:0]/SDQM[3:0]BGBREBIU
(SDRAM)
BGHSRASSCASSWESCKE
SCLK0/CLKOUTSCLK1SA10SMS[3:0]AMS[3:0]ARDYAOEAWEAREPPI1D[15:8]/PF[47:40]PPI1D[7:0]PPI1CLK
PPI1SYNC1/TMR8PPI1SYNC2/TMR9PPI1SYNC3
PPI2D[15:8]/PF[39:32]PPI2D[7:0]PPI2CLK
PPI2SYNC1/TMR10PPI2SYNC2/TMR11PPI2SYNC3EMUTCKTDOTDITMSTRSTTypeSignalsFunctionOI/OOOIOOOOOOOOOOIOOOI/OI/OII/OI/OI/OI/OI/OII/OI/OI/OOIOIII
243241111111111441111881111881111111111
Address Bus for Async/Sync Access
Data Bus for Async/Sync AccessByte Enables/Data Masks for Async/Sync AccessBus GrantBusRequest
Bus Grant Hang Row Address StrobeColumn Address StrobeWriteEnable Clock Enable
Clock Output Pin 0Clock Output Pin 1SDRAM A10 PinBank SelectBank Select
Hardware Ready ControlOutput EnableWriteEnableRead Enable
PPI Data / Programmable Flag PinsPPI Data PinsPPI Clock
PPI Sync / TimerPPI Sync / TimerPPI Sync
PPI Data / Programmable Flag PinsPPI Data PinsPPI Clock
PPI Sync / TimerPPI Sync / TimerPPI Sync
Emulation OutputJTAG Clock
JTAG Serial Data OutJTAG Serial Data InJTAG Mode SelectJTAG Reset
Preliminary Technical Data
Driver Pull-up/down requirementType
noneAA
AA
nonenone
none
pull-up required if function not usednonenonenonenonenonenonenonenonenonenone
pull-up required if function not usednonenonenone
software configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonesoftware configurable, nonenone
internal pull-downnone
internal pull-downinternal pull-down
external down necessary if JTAG not used
-AAAAABBAAA-AAACC-CCCCC-CCCC-C---
EBIU(ASYNC)
PPI1
PPI2
JTAG
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Preliminary Technical Data
Table 8.Pin Descriptions (Continued)
BlockUART
Pin NameRX/PF27TX/PF26
SPI
MOSIMISOSCK
SPORT0
RSCLK0/PF28RFS0/PF19DR0PRIDR0SEC/PF20TSCLK0/PF29TFS0/PF16DT0PRI/PF18DT0SEC/PF17
SPORT1
RSCLK1/PF30RFS1/PF24DR1PRIDR1SEC/PF25TSCLK1/PF31TFS1/PF21DT1PRI/PF23DT1SEC/PF22
TypeSignalsFunctionI/OI/OI/OI/OI/OI/OI/OII/OI/OI/OI/OI/OI/OI/OII/OI/OI/OI/OI/O
111111111111111111111
UART Receive
/ Programmable FlagUART Transmit
/ Programmable FlagMaster Out Slave InMaster In Slave OutSPI Clock
Sport0 / Programmable FlagSport0 Receive Frame Sync/ Programmable Flag
Sport0 Receive Data PrimarySport0 Receive Data Secondary / Programmable Flag
Sport0 Transmit Serial Clock / Programmable Flag
Sport0 Transmit Frame Sync / Programmable Flag
Sport0 Transmit Data Primary / Programmable Flag
Sport0 Transmit Data Secondary/ Programmable Flag
Sport1 / Programmable FlagSport1 Receive Frame Sync/ Programmable Flag
Sport1 Receive Data PrimarySport1 Receive Data Secondary / Programmable Flag
Sport1 Transmit Serial Clock / Programmable Flag
Sport1 Transmit Frame Sync / Programmable Flag
Sport1 Transmit Data Primary / Programmable Flag
Sport1 Transmit Data Secondary / Programmable Flag
ADSP-BF561
Driver Pull-up/down requirementTypeCsoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Cpull-up is necessary if booting via SPIDsoftware configurable,
no pull-up/down necessary
Dsoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
-software configurable, no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Dsoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Dsoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
-software configurable, no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Dsoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Csoftware configurable,
no pull-up/down necessary
Rev. PrC|Page 17 of 52|April 2004
ADSP-BF561
Table 8.Pin Descriptions (Continued)
BlockPF/TIMER
Pin NamePF15/EXT CLKPF14PF13PF12PF11PF10PF9PF8PF7/SPISEL7/TMR7
PF6/SPISEL6/TMR6
PF5/SPISEL5/TMR5
PF4/SPISEL4/TMR4
PF3/SPISEL3/TMR3
PF2/SPISEL2/TMR2
PF1/SPISEL1/TMR1PF0/SPISS/TMR0CLKINXTALRESETSLEEP
BMODE[1:0]
TypeSignalsFunctionI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OI/OIOIOI
111111111111111111112
Preliminary Technical Data
Driver Pull-up/down requirementType
Programmable FlagCsoftware configurable, / external timer clock inputno pull-up/down necessaryProgrammable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable FlagCsoftware configurable,
no pull-up/down necessary
Programmable Flag / SPI Select Csoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI SelectCsoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI Select Csoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI Select Csoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI SelectCsoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI SelectCsoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / SPI Select Csoftware configurable, / Timerno pull-up/down necessaryProgrammable Flag / Slave SPI Select Csoftware configurable, / Timerno pull-up/down necessaryClock input -needs to be at a level or
clocking
Crystal connection-noneChip reset signal-always active if core power onSleepCnoneDedicated Mode Pin, Configures-pull-up or pull-down requiredthe boot mode that is employed following a hardware reset or software reset
PLL BYPASS control-pull-up or pull-down requiredNon Maskable interrupt Core A-pull-down required if function not
used
Non Maskable interrupt Core B-pull-down required if function not
used
Regulation output-N/A
Clock
GeneratorModeControls
BYPASSNMI0NMI1
Regulator
VROUT1-0
IIIO
1112
Rev. PrC|Page 18 of 52|April 2004
Preliminary Technical Data
Table 8.Pin Descriptions (Continued)
BlockSupplies
Pin NameVDDEXTVDDINTGND
No Connection
TypeSignalsFunctionPPGNC
2314412256
Power Supply Power Supply
Power Supply ReturnNC
Driver Type----
ADSP-BF561
Pull-up/down requirementN/AN/AN/AN/A
Total pins
Rev. PrC|Page 19 of 52|April 2004
ADSP-BF561
SPECIFICATIONS
Note that component specifications are subject to change with-out notice.
Preliminary Technical Data
RECOMMENDED OPERATING CONDITIONS
ParameterVDDINTVDDEXTVIHVILTAMBIENTParameter
Internal Supply VoltageExternal Supply Voltage
High Level Input Voltage1, @ VDDEXT=maximumLow Level Input Voltage2, @ VDDEXT=minimumAmbient Operating Temperature
IndustrialCommercial
Minimum0.82.252.0–0.3-400
Nominal1.2
2.5 or 3.3
MaximumTBD3.63.60.68570
UnitVVVVºCºC
1The ADSP-BF561 is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bi-directional and input only pins.
ELECTRICAL CHARACTERISTICS
ParameterTest ConditionsVOHHigh Level Output Voltage1 @ VDDEXT =3.0V, IOH = –0.5 mAVOLLow Level Output Voltage1@ VDDEXT =3.0V, IOL = 2.0 mAIILLow Level Input Current2 @ VDDEXT =maximum, VIN = 0 V
High Level Input Current3@ VDDEXT =maximum, VIN = VDD maximumIIHIIHHigh Level Input Current4@ VDDEXT =maximum, VIN = VDD maximumIOZHThree-State Leakage Current5@ VDDEXT = maximum, VIN = VDD maximumIOZLThree-State Leakage Current5@ VDDEXT = maximum, VIN = 0 VCINInput Capacitance6,7fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5V
12Minimum
2.4-10
Maximum0.4105010
-10
TBD
UnitVVVµAµAµAµApF
Applies to output and bidirectional pins.Applies to all input pins.3Applies to all input pins except TCK, TDI, TMS, and TRST.4Applies to TCK, TDI, TMS, and TRST.5Applies to three-statable pins.6Applies to all signal pins.7Guaranteed, but not tested.
Rev. PrC|Page 20 of 52|April 2004
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Internal (Core) Supply Voltage1 (VDDINT)External (I/O) Supply Voltage1 (VDDEXT)Input Voltage1
Output Voltage Swing1Load Capacitance1 ,2Core Clock (CCLK)1
ADSP-BF561SKBCZ600 ADSP-BF561SKBCZ500 System Clock (SCLK)1Storage Temperature Range1Junction Temperature Under BiasLead Temperature (5 seconds)11ADSP-BF561
–0.3 V to +1.4 V–0.3Vto+3.8V–0.5 V to 3.6 V
–0.5 V to VDDEXT+0.5 V200 pF
600 MHz500 MHz133 MHz
–65ºC to +150ºC125ºC185ºC
Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.2For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at 3.3V) or 30 pF (at 2.5V) for ADDR25-2, DATA31-0, ABE3-0/SDQM3-0, CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection.
Although the ADSP-BF561 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precau-tions are recommended to avoid performance degradation or loss of functionality.
Rev. PrC|Page 21 of 52|April 2004
ADSP-BF561
TIMING SPECIFICATIONS
Table9 and Table12 describe the timing requirements for the ADSP-BF561 clocks. Take care in selecting MSEL, SSEL, and CSEL ratios so as not to exceed the maximum core clock, system clock and Voltage Controlled Oscillator (VCO) operating fre-
Preliminary Technical Data
quencies, as described in Absolute Maximum Ratings on Page21. Table12 describes Phase-Locked Loop operating conditions.
Table 9.Core and System Clock Requirements—ADSP-BF561SKBCZ500
ParametertCCLKCore Cycle Period (VDDINT=1.4 V–± 50 mV)
Core Cycle Period (VDDINT=1.35 V–5%)tCCLKtCCLKCore Cycle Period (VDDINT=1.2 V–5%)tCCLKCore Cycle Period (VDDINT=1.1 V–5%)tCCLKCore Cycle Period (VDDINT=1.0 V–5%)tCCLKCore Cycle Period (VDDINT=0.9 V–5%)tCCLKCore Cycle Period (VDDINT=0.8 V)
Minimum
nana22.252.703.204.00
Maximum
Unitnsnsnsnsnsnsns
Table 10.Core and System Clock Requirements—ADSP-BF561SKBCZ600X
ParametertCCLKCore Cycle Period (VDDINT=1.4 V–± 50 mV)
Core Cycle Period (VDDINT=1.35 V–5%)tCCLKtCCLKCore Cycle Period (VDDINT=1.2 V–5%)tCCLKCore Cycle Period (VDDINT=1.1 V–5%)tCCLKCore Cycle Period (VDDINT=1.0 V–5%)tCCLKCore Cycle Period (VDDINT=0.9 V–5%)tCCLKCore Cycle Period (VDDINT=0.8 V)
Minimum
nana1.662.252.703.204.00
Maximum
Unitnsnsnsnsnsnsns
Table 11.Core and System Clock Requirements—ADSP-BF561SBB600
ParametertCCLKCore Cycle Period (VDDINT=1.4 V–± 50 mV)tCCLKCore Cycle Period (VDDINT=1.35 V–5%)
Core Cycle Period (VDDINT=1.2 V–5%)tCCLKtCCLKCore Cycle Period (VDDINT=1.1 V–5%)tCCLKCore Cycle Period (VDDINT=1.0 V–5%)tCCLKCore Cycle Period (VDDINT=0.9 V–5%)tCCLKCore Cycle Period (VDDINT=0.8 V)
Minimum
na1.662.02.252.703.204.00
Maximum
Unitnsnsnsnsnsnsns
Table 12.Phase-Locked Loop Operating Conditions
Parameter
Voltage Controlled Oscillator (VCO) Frequency
Minimum50
Maximum
Maximum CCLK
UnitMHz
Rev. PrC|Page 22 of 52|April 2004
Preliminary Technical Data
Clock and Reset Timing
Table13 and Figure7 describe clock and reset operations. Per Figure7, combinations of CLKIN and clock multipliers must not select core/peripheral clocks in excess of 600/133 MHz.Table 13.Clock and Reset Timing
Parameter
Timing Requirements
CLKIN PeriodtCKINtCKINLCLKIN Low Pulse1tCKINHCLKIN High Pulse1tWRSTRESET Asserted Pulsewidth Low2Switching CharacteristicstSCLKCLKOUT Period312ADSP-BF561
Min25.0
10.010.011tCKIN7.Max100.0
Unitnsnsnsnsns
Applies to bypass mode and non-bypass mode.
Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2000 CLKIN cycles, while RESET is asserted, assuming stable power supplies and CLKIN (not including start-up time of external clock oscillator).3The figure below shows a x2 ratio between tCKIN and tSCLK, but the ratio has many programmable options. For more information, see the System Design chapter of the ADSP-BF561 Hardware Reference.4tSCLK must always also be larger than tCCLK.
tCKINCLKINtCKINLRESETtCKINHtWRSTtSCLKDCLKOUTtSCLKFigure 7.Clock and Reset Timing
Rev. PrC|Page 23 of 52|April 2004
ADSP-BF561
Asynchronous Memory Read Cycle TimingTable 14.Asynchronous Memory Read Cycle Timing
ParameterTiming RequirementstSDATtHDATtSARDYtHARDYDATA15–0 Setup Before CLKOUTDATA15–0 Hold After CLKOUTARDY Setup Before CLKOUTARDY Hold After CLKOUT
Preliminary Technical Data
MinMaxUnit
2.10.84.00.0
nsnsnsns
Switching CharacteristictDOtHO1Output Delay After CLKOUT1Output Hold After CLKOUT 10.8
6.0nsns
Output pins include AMS3–0, ABE3–0, ADDR25–2, AOE, ARE.SETUP2CYCLESCLKOUTPROGRAMMEDREADACCESS4CYCLESACCESSEXTENDED3CYCLESHOLD1CYCLEtDOAMSxtHOABE1–0ADDR19–1BE,ADDRESSAOEtDOAREtHOtSARDYARDYtHARDYtHARDYtSARDYtSDATtHDATDATA15–0READFigure 8.Asynchronous Memory Read Cycle Timing
Rev. PrC|Page 24 of 52|April 2004
Preliminary Technical Data
Asynchronous Memory Write Cycle TimingTable 15.Asynchronous Memory Write Cycle Timing
ParameterTiming RequirementstSARDYtHARDYARDY Setup Before CLKOUTARDY Hold After CLKOUT
4.00.0Min
Max
ADSP-BF561
Unit
nsns
Switching CharacteristictDDATtENDATtDOtHO1DATA15–0 Disable After CLKOUTDATA15–0 Enable After CLKOUTOutput Delay After CLKOUT1Output Hold After CLKOUT 10.81.0
6.0nsns
6.0nsns
Output pins include AMS3–0, ABE3–0, ADDR25–2, DATA31–0, AOE, AWE.SETUP2CYCLESPROGRAMMEDWRITEACCESS2CYCLESACCESSEXTENDED1CYCLEHOLD1CYCLECLKOUTtDOAMSxtHOABE1–0ADDR19–1BE,ADDRESStDOAWEtHOtSARDYARDYtHARDYtENDATDATA15–0WRITEDATAtSARDYtDDATFigure 9.Asynchronous Memory Write Cycle Timing
Rev. PrC|Page 25 of 52|April 2004
ADSP-BF561
SDRAM Interface TimingTable 16.SDRAM Interface Timing
ParameterTiming RequirementtSSDATtHSDATDATA Setup Before CLKOUTDATA Hold After CLKOUT
Preliminary Technical Data
MinMaxUnit
2.10.8
nsns
Switching CharacteristictSCLKtSCLKHtSCLKLtDCADtHCADtDSDATtENSDAT1CLKOUT PeriodCLKOUT Width HighCLKOUT Width Low
Command, ADDR, Data Delay After CLKOUT1Command, ADDR, Data Hold After CLKOUT1Data Disable After CLKOUTData Enable After CLKOUT
7.52.52.5
6.0
0.8
6.0
1.0
nsnsnsnsnsnsns
Command pins include: SRAS, SCAS, SWE, SDQM, SMS3-0, SA10, SCKE.tSCLKCLKOUTtSCLKHtSSDATtHSDATDATA(IN)tSCLKLtDCADtENSDATDATA(OUT)tDSDATtHCADtDCADCMNDADDR(OUT)tHCADNOTE:COMMAND=SRAS,SCAS,SWE,SDQM,SMS,SA10,SCKE.Figure 10.SDRAM Interface Timing
Rev. PrC|Page 26 of 52|April 2004
Preliminary Technical Data
External Port Bus Request and Grant Cycle TimingTable17 and Figure11 describe external port bus request and bus grant operations.
Table 17.External Port Bus Request and Grant Cycle Timing
Parameter, 1, 2Timing RequirementstBStBHBR asserted to CLKOUT high setupCLKOUT high to BR de-asserted hold time4.60.0Min
Max
ADSP-BF561
Unit
nsns
Switching CharacteristicstSDtSEtDBGtEBGtDBHtEBH12CLKOUT low to SMS, address, and RD/WR disableCLKOUT low to SMS, address, and RD/WR enableCLKOUT high to BG asserted setupCLKOUT high to BG de-asserted hold timeCLKOUT high to BGH asserted setupCLKOUT high to BGH de-asserted hold time4..53.63.63.63.6
nsnsnsnsnsns
These are preliminary timing parameters that are based on worst-case operating conditions.The pad loads for these timing parameters are 20pF.
CLKOUTtBSBRtBHtSDtSEAMSxtSDtSEADDR25-2ABE3-0tSDtSEAWEAREtDBGBGtEBGtDBHBGHtEBHFigure 11.External Port Bus Request and Grant Cycle Timing
Rev. PrC|Page 27 of 52|April 2004
ADSP-BF561
Parallel Peripheral Interface Timing
Table18, Figure12, describes Parallel Peripheral Interface operations.
Table 18.Parallel Peripheral Interface Timing
Parameter
Timing RequirementstPCLKWPPIx_CLK Width1tPCLKPPI_CLK Period1Timing Requirements tSFSPEExternal Frame Sync Setup Before PPI_CLK
External Frame Sync H old After PPI_CLKtHFSPEtSDRPEReceive Data Setup Before PPI_CLKtHDRPEReceive Data Hold After PPI_CLKSwitching Characteristics tDFSPEInternal Frame Sync Delay After PPI_CLKtHOFSPEInternal Frame Sync Hold After PPI_CLK
Transmit Data Delay After PPI_CLK tDDTPEtHDTPETransmit Data Hold After PPI_CLK
1Preliminary Technical Data
Min6.0
15.03.03.0TBDTBD
MaxUnitnsnsnsnsnsns
10.0
0.0
10.0
0.0nsnsnsns
PPI_CLK frequency cannot exceed fSCLK/2
DRIVEEDGESAMPLEEDGEtPCLKWPPI_CLKtDFSPEtHOFSPEPPI_FS1PPI_FS2tSFSPEtHFSPEtDDTPEtHDTPEPPIxtSDRPEtHDRPEFigure 12.Timing Diagram PPI
Rev. PrC|Page 28 of 52|April 2004
Preliminary Technical Data
Serial Ports
Table19 through Table24 on Page30 and Figure13 on Page31 through Figure15 on Page33 describe Serial Port operations. Table 19.Serial Ports—External Clock
ParameterTiming RequirementstSFSEtHFSEtSDREtHDREtSCLKWtSCLK1ADSP-BF561
MinMaxUnit
TFS/RFS Setup Before TSCLK/RSCLK1TFS/RFS Hold After TSCLK/RSCLK1Receive Data Setup Before RSCLK1Receive Data Hold After RSCLK1TSCLK/RSCLK WidthTSCLK/RSCLK Period
3.03.03.03.04.515.0
nsnsnsnsnsns
Referenced to sample edge.
Table 20.Serial Ports—Internal Clock
ParameterTiming RequirementstSFSItHFSItSDRItHDRItSCLKWtSCLK1MinMaxUnit
TFS/RFS Setup Before TSCLK/RSCLK1TFS/RFS Hold After TSCLK/RSCLK1Receive Data Setup Before RSCLK1Receive Data Hold After RSCLK1TSCLK/RSCLK WidthTSCLK/RSCLK Period
TBDTBD6.00.04.515.0
nsnsnsnsnsns
Referenced to sample edge.
Table 21.Serial Ports—External Clock
Parameter
Switching CharacteristicstDFSEtHOFSEtDDTEtHDTE1MinMaxUnit
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1Transmit Data Delay After TSCLK1Transmit Data Hold After TSCLK10.00.0
10.0nsns
10.0nsns
Referenced to drive edge.
Rev. PrC|Page 29 of 52|April 2004
ADSP-BF561
Table 22.Serial Ports—Internal Clock
Parameter
Switching CharacteristicstDFSItHOFSItDDTItHDTItSCLKIW1Preliminary Technical Data
Min
Max
Unit
TFS/RFS Delay After TSCLK/RSCLK (Internally Generated TFS/RFS)1TFS/RFS Hold After TSCLK/RSCLK (Internally Generated TFS/RFS)1Transmit Data Delay After TSCLK1Transmit Data Hold After TSCLK1TSCLK/RSCLK Width
TBD4.5TBD
TBDnsns
TBDnsnsns
Referenced to drive edge.
Table 23.Serial Ports—Enable and Three-State
Parameter
Switching CharacteristicstDTENEtDDTTEtDTENItDDTTI1MinMaxUnit
Data Enable Delay from External TSCLK1Data Disable Delay from External TSCLK1Data Enable Delay from Internal TSCLKData Disable Delay from Internal TSCLK1TBD
TBD
TBD
TBD
nsnsnsns
Referenced to drive edge.
Table 24.External Late Frame Sync
Parameter
Switching CharacteristicstDDTLFSEtDTENLFSE12MinMaxUnit
Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 01,2Data Enable from late FS or MCE = 1, MFD = 01,2TBD
TBDnsns
MCE = 1, TFS enable and TFS valid follow tDDTENFS and tDDTLFSE.
If external RFS/TFS setup to RSCLK/TSCLK > tSCLK/2 then tDDTLSCK and tDTENLSCK apply, otherwise tDDTLFSE and tDTENLFS apply.
Rev. PrC|Page 30 of 52|April 2004
Preliminary Technical Data
DATARECEIVE—INTERNALCLOCKDRIVEEDGESAMPLEEDGEDATARECEIVE—EXTERNALCLOCKDRIVEEDGEADSP-BF561
SAMPLEEDGEtSCLKIWRCLKRCLKtSCLKWtDFSEtHOFSERFStDFSEtSFSItHFSIRFStHOFSEtSFSEtHFSEtSDRIDRtHDRIDRtSDREtHDRENOTE:EITHERTHERISINGEDGEORFALLINGEDGEOFRCLK,TCLKCANBEUSEDASTHEACTIVESAMPLINGEDGE.DATATRANSMIT—INTERNALCLOCKDRIVEEDGESAMPLEEDGEDATATRANSMIT—EXTERNALCLOCKDRIVEEDGESAMPLEEDGEtSCLKIWTCLKTCLKtSCLKWtDFSItHOFSITFStDFSEtSFSItHFSITFStHOFSEtSFSEtHFSEtHDTIDTtDDTIDTtHDTEtDDTENOTE:EITHERTHERISINGEDGEORFALLINGEDGEOFRCLKORTCLKCANBEUSEDASTHEACTIVESAMPLINGEDGE.DRIVEEDGETCLK(EXT)TFS(“LATE”,EXT)TCLK/RCLKDRIVEEDGEtDDTENDTDRIVEEDGETCLK(INT)TFS(“LATE”,INT)TCLK/RCLKtDDTTEDRIVEEDGEtDDTINtDDTTIDTFigure 13.Serial Ports
Rev. PrC|Page 31 of 52|April 2004
ADSP-BF561
EXTERNALRFSWITHMCE=1,MFD=0DRIVERSCLKSAMPLEDRIVEPreliminary Technical Data
tSFSE/ItHOFSE/IRFStDDTENFStDDTE/ItHDTE/I1STBIT2NDBITDTtDDTLFSELATEEXTERNALTFSDRIVETSCLKSAMPLEDRIVEtSFSE/ItHOFSE/ITFStDDTENFSDT1STBITtDDTE/ItHDTE/I2NDBITtDDTLFSEFigure 14.External Late Frame Sync (Frame Sync Setup < tSCLK/2)
Rev. PrC|Page 32 of 52|April 2004
Preliminary Technical Data
EXTERNALRFSWITHMCE=1,MFD=0DRIVESAMPLEDRIVEADSP-BF561
RSCLKtSFSE/ItHOFSE/IRFStDTENLSCKtDDTE/ItHDTE/I2NDBITDT1STBITtDDTLSCKLATEEXTERNALTFSDRIVESAMPLEDRIVETSCLKtSFSE/ItHOFSE/ITFStDDTE/ItDTENLSCKtHDTE/I2NDBITDT1STBITtDDTLSCKFigure 15.External Late Frame Sync (Frame Sync Setup > tSCLK/2)
Rev. PrC|Page 33 of 52|April 2004
ADSP-BF561
Serial Peripheral Interface (SPI) Port—Master TimingTable25 and Figure16 describe SPI port master operations. Table 25.Serial Peripheral Interface (SPI) Port—Master Timing
ParameterTiming RequirementstSSPIDM tHSPIDMData input valid to SCK edge (data input setup)SCK sampling edge to data input invalid
Preliminary Technical Data
MinMaxUnit
TBDTBD
nsns
Switching CharacteristicstSDSCIMtSPICHMtSPICLMtSPICLKtHDSMtSPITDMtDDSPIDMtHDSPIDMSPISELx low to first SCK edgeSerial clock high periodSerial clock low periodSerial clock period
Last SCK edge to SPISELx highSequential transfer delay
SCK edge to data out valid (data out delay)SCK edge to data out invalid (data out hold)
2tSCLK-1.52tSCLK-1.52tSCLK-1.tSCLK-1.52tSCLK-1.52tSCLK-1.5TBDTBD
TBDTBD
nsnsnsnsnsnsnsns
Rev. PrC|Page 34 of 52|April 2004
Preliminary Technical Data
SPISELx(OUTPUT)ADSP-BF561
tSDSCIMSCK(CPOL=0)(OUTPUT)tSPICHMtSPICLMtSPICLKtHDSMtSPITDMtSPICLMSCK(CPOL=1)(OUTPUT)tSPICHMtDDSPIDMMOSI(OUTPUT)CPHA=1MISO(INPUT)MSBtHDSPIDMLSBtSSPIDMMSBVALIDtHSPIDMtSSPIDMLSBVALIDtHSPIDMtDDSPIDMMOSI(OUTPUT)CPHA=0MISO(INPUT)MSBtHDSPIDMLSBtSSPIDMMSBVALIDtHSPIDMLSBVALIDFigure 16.Serial Peripheral Interface (SPI) Port—Master Timing
Rev. PrC|Page 35 of 52|April 2004
ADSP-BF561
Serial Peripheral Interface (SPI) Port—Slave TimingTable26 and Figure17 describe SPI port slave operations. Table 26.Serial Peripheral Interface (SPI) Port—Slave Timing
ParameterTiming RequirementstSPICHStSPICLStSPICLKtHDStSPITDStSDSCItSSPID tHSPIDSerial clock high periodSerial clock low periodSerial clock period
Last SCK edge to SPISS not assertedSequential Transfer DelaySPISS assertion to first SCK edgeData input valid to SCK edge (data input setup)SCK sampling edge to data input invalid
Preliminary Technical Data
MinMaxUnit
2tSCLK-1.52tSCLK-1.tSCLK-1.52tSCLK-1.52tSCLK-1.52tSCLK-1.51.61.6
nsnsnsnsnsnsnsns
Switching CharacteristicstDSOEtDSDHItDDSPIDtHDSPIDSPISS assertion to data out activeSPISS deassertion to data high impedanceSCK edge to data out valid (data out delay)SCK edge to data out invalid (data out hold)
0000
881010
nsnsnsns
Rev. PrC|Page 36 of 52|April 2004
Preliminary Technical DataADSP-BF561
SPISS(INPUT)tSPICHSSCK(CPOL=0)(INPUT)tSPICLStSPICLKtHDStSPITDStSDSCISCK(CPOL=1)(INPUT)tSPICLStSPICHStDSOEtDDSPIDtHDSPIDMSBtDDSPIDtDSDHILSBMISO(OUTPUT)CPHA=1MOSI(INPUT)tSSPIDMSBVALIDtHSPIDtSSPIDtHSPIDLSBVALIDtDSOEMISO(OUTPUT)CPHA=0MOSI(INPUT)tDDSPIDMSBLSBtDSDHItSSPIDMSBVALIDLSBVALIDtHSPIDFigure 17.Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. PrC|Page 37 of 52|April 2004
ADSP-BF561
Universal Asynchronous Receiver-Transmitter (UART) Port—Receive and Transmit Timing
Figure18 describes UART port receive and transmit operations. The maximum baud rate is SCLK/16. As shown in Figure18 there is some latency between the generation internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART.
Preliminary Technical Data
CLKOUT(SAMPLECLOCK)RXDRECEIVEINTERNALUARTRECEIVEINTERRUPTDATA(5–8)STOPUARTRECEIVEBITSETBYDATASTOP;CLEAREDBYFIFOREADSTARTTXDASDATAWRITENTOBUFFERUARTTRANSMITBITSETBYPROGRAM;CLEAREDBYWRITETOTRANSMITDATA(5–8)STOP(1–2)TRANSMITINTERNALUARTTRANSMITINTERRUPTFigure 18.UART Port—Receive and Transmit Timing
Rev. PrC|Page 38 of 52|April 2004
Preliminary Technical Data
Timer Cycle Timing
Table27 and Figure19 describe timer expired operations. The input signal is asynchronous in “width capture mode” and “external clock mode” and has an absolute maximum input fre-quency of fSCLK/2 MHz.Table 27.Timer Cycle Timing
Parameter
Timing CharacteristicstWLtWHTimer Pulsewidth Input Low1Timer Pulsewidth Input High111Min
Max
ADSP-BF561
Unit
SCLKcyclesSCLKcycles
Switching CharacteristictHTO12Timer Pulsewidth Output21
(232–1)
SCLK cycles
The minimum pulsewidths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPICLK input pins in PWM output mode.The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.
CLKOUTtHTOTMRx(PWMOUTPUTMODE)TMRx(WIDTHCAPTUREANDEXTERNALCLOCKMODES)tWLtWHFigure 19.Timer PWM_OUT Cycle Timing
Rev. PrC|Page 39 of 52|April 2004
ADSP-BF561
Programmable Flags Cycle Timing
Table28 and Figure20 describe programmable flag operations. Table 28.Programmable Flags Cycle Timing
ParameterTiming RequirementtWFIFlag input pulsewidth
Preliminary Technical Data
MinMaxUnit
tSCLK + 1
ns
Switching CharacteristictDFOFlag output delay from CLKOUT low
TBD
ns
CLKOUTtDFOPF(OUTPUT)FLAGOUTPUTtWFIPF(INPUT)FLAGINPUTFigure 20.Programmable Flags Cycle Timing
Rev. PrC|Page 40 of 52|April 2004
Preliminary Technical Data
JTAG Test And Emulation Port Timing
Table29 and Figure21 describe JTAG port operations. Table 29.JTAG Port Timing
ParameterTiming ParameterstTCKtSTAPtHTAPtSSYStHSYStTRSTWTCK Period
TDI, TMS Setup Before TCK HighTDI, TMS Hold After TCK HighSystem Inputs Setup Before TCK High1System Inputs Hold After TCK High1TRST Pulsewidth220444Min
Max
ADSP-BF561
Unit
nsnsnsnsns
TCKcycles
10
nsns
Switching CharacteristicstDTDOtDSYS1TDO Delay from TCK Low
System Outputs Delay After TCK Low30
12
System Inputs=DATA31-0, ARDY, TMR2-0, PF47-0, PPIx_CLK, RSCLK0-1, RFS0-1, DR0PRI, DR0SEC, TSCLK0-1, TFS0-1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX, RESET, NMI, BMODE1-0, BR, PPIxD7-0.250MHz max.3System Outputs=DATA31-0, ADDR25-2, ABE3-0, AOE, ARE, AWE, AMS3-0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS3-0, PF47-0, RSCLK0-1, RFS0-1, TSCLK0-1, TFS0-1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPIxD7-0.tTCKTCKtSTAPTMSTDItHTAPtDTDOTDOtSSYSSYSTEMINPUTStHSYStDSYSSYSTEMOUTPUTSFigure 21.JTAG Port Timing
Rev. PrC|Page 41 of 52|April 2004
ADSP-BF561
POWER DISSIPATION
Total power dissipation has two components, one due to inter-nal circuitry (PINT) and one due to the switching of external output drivers (PEXT). Table30 shows the power dissipation for internal circuitry (VDDINT). Internal power dissipation is depen-dent on the instruction execution sequence and the data operands involved.
Table 30.Internal Power Dissipation
Test Conditions1
ParameterfCCLK = fCCLK =
50 MHz400 MHzVDDINT =VDDINT =0.8 V1.2 V2TBDTBDIDDTYPIDDSLEEP3TBDTBD
TBDIDDDEEPSLEEPTBD
3Preliminary Technical Data
The external component is calculated using:
PEXT=O×C×V
2DD
×f
The frequency f includes driving the load high and then back
low. For example: DATA15–0 pins can drive high and low at a maximum rate of 1/(23tSCLK) while in SDRAM burst mode.A typical power consumption can now be calculated for these conditions by adding a typical internal power dissipation.
PTotal=PEXT+(IDD×VDDINT)
fCCLK = 600 MHzVDDINT =1.2 V520TBD70TBD
fCCLK = 600 MHzVDDINT =1.35 VTBDTBDTBDTBD
Unit
mAmAmAA
IDDHI-1BERNATE4TBDTBD
Note that the conditions causing a worst-case PEXT differ from those causing a worst-case PINT. Maximum PINT cannot occur while 100% of the output pins are switching from all ones (1s) to all zeros (0s). Note also that it is not common for an application to have 100%,or even 50%, of the outputs switching simultaneously.
IDD data is specified for typical process parameters. All data at 25ºC.2Processor executing 75% dual Mac, 25% ADD with moderate data bus activity.3See the ADSP-BF53x Blackfin Processor Hardware Reference Manual for definitions of Sleep and Deep Sleep operating modes.4Measured at VDDEXT = 3.65V with voltage regulator off (VDDINT = 0V).
OUTPUT DRIVE CURRENTS
Figure22 shows typical I-V characteristics for the output driv-ers of the ADSP-BF561. The curves represent the current drive capability of the output drivers as a function of output voltage.
120100SOURCE(VDDEXT)CURRENT-mAThe external component of total power dissipation is caused by the switching of output pins. Its magnitude depends on•The number of output pins that switch during each cycle (O)
•The maximum frequency at which they can switch (f)•Their load capacitance (C)•Their voltage swing (VDDEXT)
806040200-20-40-60-80-100-12000.511.522.5SOURCE(VDDEXT)VOLTAGE-V33.5DBTFigure 22.ADSP-BF561 Typical Drive
TEST CONDITIONS
The ac signal specifications (timing parameters) appear in Tim-ing Specifications on Page22. These include output disable
time, output enable time, and capacitive loading. The timing specifications for the DSP apply for the voltage reference levels
in Figure23.
INPUTOROUTPUT1.5V1.5VFigure 23.Voltage Reference Levels for AC Measurements (Except Output
Enable/Disable)
Rev. PrC|Page 42 of 52|April 2004
Preliminary Technical Data
Output Enable Time
Output pins are considered to be enabled when they have made a transition from a high impedance state to the point when they start driving. The output enable time tENA is the interval from the point when a reference signal reaches a high or low voltage level to the point when the output starts driving as shown in the Output Enable/Disable diagram (Figure24). The time
tENA_MEASURED is the interval from when the reference signal switches to when the output voltage reaches 2.0V (output high) or 1.0V (output low). Time tTRIP is the interval from when the output starts driving to when the output reaches the 1.0V or 2.0V trip voltage. Time tENA is calculated as
tENA_MEASURED–tTRIP. If multiple pins (such as the data bus) are enabled, the measurement value is that of the first pin to start driving.
ADSP-BF561
time. A typical ⌬V will be 0.4 V. CL is the total bus capacitance (per data line), and IL is the total leakage or three-state current (per data line). The hold time will be tDECAY plus the minimum disable time (i.e., tDSDAT for an SDRAM write cycle).
5OUTPUTDELAYORHOLD-ns432DBTOutput Disable Time
Output pins are considered to be disabled when they stop driv-ing, go into a high impedance state, and start to decay from their
output high or low voltage. The time for the voltage on the bus to decay by ⌬V is dependent on the capacitive load, CL and the load current, IL. This decay time can be approximated by the following equation:
tDECAY=(CL∆V)⁄IL
The output disable time tDIS is the difference between tDIS_MEASURED and tDECAY as shown in Figure24.The time tDIS_MEASURED is the interval from when the reference signal switches to when the output voltage decays ⌬V from the mea-sured output high or output low voltage. tDECAY is calculated with test loads CL and IL, and with ⌬V equal to 0.5 V.
1NOMINAL-50306090120150LOADCAPACITANCE-pF180210Figure 25.Typical Output Delay or Hold vs. Load Capacitance (at Max Case
Temperature)
REFERENCESIGNALtDIS-MEASUREDtDISVOH(MEASURED)VOL(MEASURED)tENA-MEASUREDtENAVOH(MEASURED)-⌬VVOL(MEASURED)+⌬VVOH2.0V(MEASURED)1.0VVOL(MEASURED)tDECAYtTRIPOUTPUTSTOPSDRIVINGOUTPUTSTARTSDRIVINGHIGH-IMPEDANCESTATE.TESTCONDITIONSCAUSETHISVOLTAGETOBEAPPROXIMATELY1.5V.Figure 24.Output Enable/Disable
EXAMPLE SYSTEM HOLD TIME CALCULATION
To determine the data output hold time in a particular system, first calculate tDECAY using the equation given above. Choose ⌬V to be the difference between the ADSP-BF561's output volt-age and the input threshold for the device requiring the hold
Rev. PrC|Page 43 of 52|April 2004
ADSP-BF561
CAPACITIVE LOADING
Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure26 on Page44). Figure25 shows graphically how output delays and holds vary with load capaci-tance (Note that this graph or derating does not apply to output disable delays; see Output Disable Time on Page43). The graphs of Figure25, Figure27 and Figure28 may not be linear outside the ranges shown, for Typical Output Delay vs. Load Capaci-tance and Typical Output Rise Time (10%-90%, V=Min) vs. Load Capacitance.
3.53.02.52.01.51.00.5050VTOOUTPUTPIN1.5VPreliminary Technical Data
RISEANDFALLTIMES-ns(0.v-v,20%-80%)DBT020406080100120140LOADCAPACITANCE-pF160180200Figure 28.Typical Output Rise/Fall Time (10%-90%, Vddext = Min)
20pFFigure 26.Equivalent Device Loading for AC Measurements (Includes All
Fixtures)
16.014.012.010.08.06.04.02.00RISEANDFALLTIMES-ns(.v-v,20%-80%)DBT020406080100120140LOADCAPACITANCE-pF160180200Figure 27.Typical Output Rise/Fall Time (10%-90%, Vddext = Max)
Rev. PrC|Page 44 of 52|April 2004
Preliminary Technical Data
256-BALL MBGA PIN CONFIGURATIONS
Table 31.256-Lead MBGA Pin Assignments
MBGAPin No.A01A02A03A04A05A06A07A08A09A10A11A12A13A14A15A16E01E02E03E04E05E06E07E08E09E10E11E12E13E14E15E16
Pin NameVDDEXTADDR24ADDR20VDDEXTADDR14ADDR10AMS3AWEVDDEXTSMS3SCLK0/CLKOUTSCLK1BGABE2/SDQM2ABE3/SDQM3VDDEXTGNDPPI1D11/PF43PPI1D12/PF44PPI1SYNC1/TMR8ADDR15ADDR13AMS2VDDINTSMS0SWEABE0/SDQM0DATA2GNDDATA4DATA7VDDEXT
MBGAPin No.B01B02B03B04B05B06B07B08B09B10B11B12B13B14B15B16F01F02F03F04F05F06F07F08F09F10F11F12F13F14F15F16
Pin NamePPI2CLKADDR22ADDR18ADDR16ADDR12VDDEXTAMS1ARESMS1SCKEVDDEXTBRABE1/SDQM1ADDR06ADDR04DATA0CLKINVDDEXTRESETPPI1D10/PF42ADDR21ADDR17VDDINTGNDVDDINTGNDADDR08DATA10DATA8DATA12DATA9DATA11
MBGAPin No.C01C02C03C04C05C06C07C08C09C10C11C12C13C14C15C16G01G02G03G04G05G06G07G08G09G10G11G12G13G14G15G16
Pin NamePPI1SYNC2/TMR9PPI1CLKADDR25ADDR19GNDADDR11AOEAMS0SMS2SRASGNDBGHGNDADDR07DATA1DATA3XTALGNDVDDEXTBYPASSPPI1D14/PF46GNDGNDGNDVDDINTADDR05ADDR03DATA15DATA14GNDDATA13VDDEXT
MBGAPin No.D01D02D03D04D05D06D07D08D09D10D11D12D13D14D15D16H01H02H03H04H05H06H07H08H09H10H11H12H13H14H15H16
ADSP-BF561
Pin NamePPI1D13/PF45PPI1D15/PF47PPI1SYNC3ADDR23GNDGNDADDR09GNDARDYSCASSA10VDDEXTADDR02GNDDATA5DATA6GNDGNDPPI1D9/PF41PPI1D7PPI1D5VDDINTVDDINTGNDGNDGNDVDDINTDATA16DATA18DATA20DATA17DATA19
Rev. PrC|Page 45 of 52|April 2004
ADSP-BF561
Table 31.256-Lead MBGA Pin Assignments (Continued)
MBGAPin No.J01J02J03J04J05J06J07J08J09J10J11J12J13J14J15J16N01N02N03N04N05N06N07N08N09N10N11N12N13N14N15N16
Pin NameVROUT0VROUT1PPI1D2PPI1D3PPI1D1VDDEXTGNDVDDINTVDDINTVDDINTGNDDATA30DATA22GNDDATA21DATA23PPI2D12/PF36PPI2D10/PF34PPI2D3PPI2D1
PF1/SPISEL1/TMR1PF9GNDPF13TDOBMODE1MOSIGNDRFS1/PF24GNDDT0SEC/PF17TSCLK0/PF29
MBGAPin No.K01K02K03K04K05K06K07K08K09K10K11K12K13K14K15K16P01P02P03P04P05P06P07P08P09P10P11P12P13P14P15P16
Pin NamePPI1D6PPI1D4PPI1D8/PF40PPI2SYNC1/TMR10PPI2D14/PF38VDDEXTGNDVDDINTGNDGNDVDDINTDATA28DATA26DATA24DATA25VDDEXTPPI2D8/PF32GNDPPI2D5PF0/SPISS/TMR0GND
PF5/SPISEL5/TMR5PF11PF15/EXTCLKGNDTRSTNMI0GNDRSCLK1/PF30TFS1/PF21RSCLK0/PF28DR0SEC/PF20
MBGAPin No.L01L02L03L04L05L06L07L08L09L10L11L12L13L14L15L16R01R02R03R04R05R06R07R08R09R10R11R12R13R14R15R16
Pin NamePPI1D0
Preliminary Technical Data
MBGAPin No.M01M02M03M04M05M06M07M08M09M10M11M12M13M14M15M16T01T02T03T04T05T06T07T08T09T10T11T12T13T14T15T16
Pin NamePPI2D15/PF39PPI2D13/PF37PPI2D9/PF33GNDNC
PF3/SPISEL3/TMR3PF7/SPISEL7/TMR7VDDINTGNDBMODE0SCKDR1PRINCVDDEXTDATA31DT0PRI/PF18VDDEXTPPI2D4VDDEXT
PF2/SPISEL2/TMR2PF6/SPISEL6/TMR6VDDEXTPF12VDDEXTTCKTMSSLEEPVDDEXTRX/PF27DR1SEC/PF25DT1SEC/PF22VDDEXT
PPI2SYNC2/TMR11GNDPPI2SYNC3VDDEXTPPI2D11/PF35GNDVDDINTGNDVDDEXTGNDDR0PRITFS0/PF16GNDDATA27DATA29PPI2D7PPI2D6PPI2D2PPI2D0
PF4/SPISEL4/TMR4PF8PF10PF14NMI1TDIBRMISOTX/PF26TSCLK1/PF31DT1PRI/PF23RFS0/PF19
Rev. PrC|Page 46 of 52|April 2004
Preliminary Technical Data
297-BALL PBGA PIN CONFIGURATIONS
Table 32.297-Lead PBGA Pin Assignments
MBGAPin No.A01A02A03A04A05A06A07A08A09A10A11A12A13A14A15A16A17A18A19A20A21A22A23A24A25A26AA01AA02AA25AA26AB01AB02
Pin NameGNDADDR25ADDR23ADDR21ADDR19ADDR17ADDR15ADDR13ADDR11ADDR09AMS3AMS1AWEARESMS0SMS2SRASSCASSCLK0/CLKOUTSCLK1BGHABE0/SDQM0ABE2/SDQM2ADDR08ADDR06GNDPPI2D13/PF37PPI2D12/PF36DT0SEC/PF17TSCLK0/PF29PPI2D11/PF35PPI2D10/PF34
MBGAPin No.AB03AB24AB25AB26AC01AC02AC03AC04AC23AC24AC25AC26AD01AD02AD03AD04AD05AD22AD23AD24AD25AD26AE01AE02AE03AE04AE05AE06AE07AE08AE09AE10
Pin NameGNDGNDTFS0/PF16DR0PRIPPI2D9/PF33PPI2D8/PF32GNDGNDGNDGNDDR0SEC/PF20RFS0/PF19PPI2D7PPI2D6GNDGNDGNDGNDGNDGNDNC
RSCLK0/PF28PPI2D5GNDPPI2D3PPI2D1PF0/SPISS/TMR0PF2/SPISEL2/TMR2PF4/SPISEL4/TMR4PF6/SPISEL6/TMR6PF8PF10
MBGAPin No.AE11AE12AE13AE14AE15AE16AE17AE18AE19AE20AE21AE22AE23AE24AE25AE26AF01AF02AF03AF04AF05AF06AF07AF08AF09AF10AF11AF12AF13AF14AF15AF16
Pin NamePF12PF14NCTDOTRSTEMUBMODE1BMODE0MISOMOSIRX/PF27RFS1/PF24DR1SEC/PF25TFS1/PF21GNDNCGNDPPI2D4PPI2D2PPI2D0
PF1/SPISEL1/TMR1PF3/SPISEL3/TMR3PF5/SPISEL5/TMR5PF7/SPISEL7/TMR7PF9PF11PF13PF15/EXT CLKNMI1TCKTDITMS
MBGAPin No.AF17AF18AF19AF20AF21AF22AF23AF24AF25AF26B01B02B03B04B05B06B07B08B09B10B11B12B13B14B15B16B17B18B19B20B21B22
ADSP-BF561
Pin NameSLEEPNMI0SCKTX/PF26RSCLK1/PF30DR1PRITSCLK1/PF31DT1SEC/PF22DT1PRI/PF23GNDPPI2CLKGNDADDR24ADDR22ADDR20ADDR18ADDR16ADDR14ADDR12ADDR10AMS2AMS0AOEARDYSMS1SMS3SCKESWESA10BRBGABE1/SDQM1Rev. PrC|Page 47 of 52|April 2004
ADSP-BF561
Table 32.297-Lead PBGA Pin Assignments (Continued)
MBGAPin No.B23B24B25B26C01C02C03C04C05C22C23C24C25C26D01D02D03D04D23D24D25D26E01E02E03E24E25E26F01F02F25F26
Pin NameABE3/SDQM3ADDR07GNDADDR05PPI1SYNC3PPI1CLKGNDGNDGNDGNDGNDGNDADDR04ADDR03PPI1SYNC1/TMR8PPI1SYNC2/TMR9GNDGNDGNDGNDADDR02DATA1PPI1D15/PF47PPI1D14/PF46GNDGNDDATA0DATA3PPI1D13/PF45PPI1D12/PF44DATA2DATA5
MBGAPin No.G01G02G25G26H01H02H25H26J01J02J10J11J12J13J14J15J16J17J18J25J26K01K02K10K11K12K13K14K15K16K17K18
Pin NamePPI1D11/PF43PPI1D10/PF42DATA4DATA7BYPASSRESETDATA6DATA9CLKINGNDVDDEXTVDDEXTVDDEXTVDDEXTVDDEXTVDDEXTVDDINTVDDINTVDDINTDATA8DATA11XTALNCVDDEXTVDDEXTVDDEXTVDDEXTVDDEXTVDDEXTVDDINTVDDINTVDDINT
MBGAPin No.K25K26L01L02L10L11L12L13L14L15L16L17L18L25L26M01M02M10M11M12M13M14M15M16M17M18M25M26N01N02N10N11
Pin NameDATA10DATA13NCNCVDDEXTGNDGNDGNDGNDGNDGNDGNDVDDINTDATA12DATA15VROUT0GNDVDDEXTGNDGNDGNDGNDGNDGNDGNDVDDINTDATA14DATA17VROUT1
Preliminary Technical Data
MBGAPin No.N12N13N14N15N16N17N18N25N26P01P02P10P11P12P13P14P15P16P17P18P25P26R01R02R10R11R12R13R14R15R16R17
Pin NameGNDGNDGNDGNDGNDGNDVDDINTDATA16DATA19PPI1D7PPI1D8/PF40VDDEXTGNDGNDGNDGNDGNDGNDGNDVDDINTDATA18DATA21PPI1D5PPI1D6VDDEXTGNDGNDGNDGNDGNDGNDGND
PPI1D9/PF41VDDEXTGND
Rev. PrC|Page 48 of 52|April 2004
Preliminary Technical Data
Table 32.297-Lead PBGA Pin Assignments (Continued)
MBGAPin No.R18R25R26T01T02T10T11T12T13T14T15
Pin NameVDDINTDATA20DATA23PPI1D3PPI1D4VDDEXTGNDGNDGNDGNDGND
MBGAPin No.T16T17T18T25T26U01U02U10U11U12U13
Pin NameGNDGNDVDDINTDATA22DATA25PPI1D1PPI1D2VDDEXTVDDEXTVDDEXTVDDEXT
MBGAPin No.U14U15U16U17U18U25U26V01V02V25V26
Pin NameGNDVDDINTVDDINTVDDINTVDDINTDATA24DATA27PPI2SYNC3PPI1D0DATA26DATA29
MBGAPin No.W01W02W25W26Y01Y02Y25Y26
ADSP-BF561
Pin NamePPI2SYNC1/TMR10PPI2SYNC2/TMR11DATA28DATA31PPI2D15/PF39PPI2D14/PF38DATA30DT0PRI/PF18
Rev. PrC|Page 49 of 52|April 2004
ADSP-BF561
OUTLINE DIMENSIONS
Dimensions in the outline dimension figure are shown in millimeters.
Preliminary Technical Data
a12.00 BSC SQ256-BALL MINI BGA (BC-256)9.75 BSC SQ0.65 BSC BALL PITCHCLA1 BALLPAD CORNERA1 BALLPAD CORNERABCDEFGHJKLMNP RTCLTOP VIEW161514131211109876321BOTTOM VIEW1.701.511.36SIDE VIEW0.25 MINDETAIL ANOTES1. DIMENSIONS ARE IN MILLIMETERS.2. COMPLIES WITH JEDEC REGISTERED OUTLINE MO-225, WITH NO EXACT PACKAGE SIZE AND EXCEPTION TO PACKAGE HEIGHT.3. MINIMUM BALL HEIGHT 0.250.10 MAXCOPLANARITYSEATING PLANE0.45BALL DIAMETER0.400.35DETAIL AFigure 29.256-Ball Mini-Ball Grid Array
Rev. PrC|Page 50 of 52|April 2004
Preliminary Technical Data
OUTLINE DIMENSIONS
Dimensions in the outline dimension figure are shown in millimeters.
ADSP-BF561
a27.00 BSC SQ297-BALL PBGA (B-297)25.00 BSC SQ1.00 BSC BALL PITCH8.00CLA1 BALLPAD CORNERA1 BALLPAD CORNERABCDEFGHJKLMNPRTUVWYAAABACADAEAF8.00CLTOP VIEW26252423222120191817161514131211109876321BOTTOM VIEW2.432.232.03SIDE VIEW0.40 MINDETAIL ANOTES1. DIMENSIONS ARE IN MILLIMETERS.2. COMPLIES WITH JEDEC REGISTERED OUTLINEMS-034, VARIATION AAL-1.3. MINIMUM BALL HEIGHT 0.400.20 MAXCOPLANARITYSEATING PLANE0.70BALL DIAMETER0.600.50DETAIL AFigure 30.297-Ball PBGA Grid Array
ORDERING GUIDE
Part NumberADSP-BF561SKBCZ600 ADSP-BF561SKBCZ500 ADSP-BF561SBB500
Ambient Temperature Range
0ºC to +70ºC0ºC to +70ºC-40ºC to +85ºC
Instruction Rate 600 MHz500 MHz500 MHz
Operating Voltage
0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O0.8 V to 1.2 V internal, 2.5 V or 3.3 V I/O
Rev. PrC|Page 51 of 52|April 2004
ADSP-BF561Preliminary Technical Data
Rev. PrC|Page 52 of 52|April 2004
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