SENSOR ASSEMBLIES AND METHODS OF ASSEMBLING SAME

专利名称：SENSOR ASSEMBLIES AND METHODS OF

ASSEMBLING SAME

发明人：Jacob John Kittleson,Shankar

Chandrasekaran,Munish Vishwas Inamdar

申请号：US14146553申请日：20140102

公开号：US20140123782A1公开日：20140508

专利附图：

摘要：A method for assembling a sensor assembly includes providing a sensing deviceconfigured to measure at least one variable. The method also includes at least partially

enclosing a magnetic material within an enclosure. At least a portion of the enclosure ismanufactured from a material having a permeability that facilitates forming a magneticfield therein. The method also includes coupling the sensing device to a first portion ofthe enclosure. The enclosure includes at least one second portion that is movable withrespect to the first portion of the enclosure such that a magnetic coupling force isinduced external to the enclosure to facilitate coupling the sensor assembly to amagnetic surface.

申请人：General Electric Company

地址：Schenectady NY US

国籍：US

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