DS90C032WG-QML资料

MICROCIRCUIT DATA SHEETMNDS90C032-X-RH REV 1B1Original Creation Date: 04/14/00Last Update Date: 08/15/03Last Major Revision Date: LVDS Quad CMOS Differential Line Receiver: ALSOAVAILABLE GUARANTEED TO 50K RAD(Si) TESTED TOMIL-STD-883, METHOD 1019.5 General DescriptionThe DS90C032 is a quad differential line receiver designed for applications requiring lowpower dissipation and high data rates. The DS90C032 accepts low voltage differential input siginal and translates them to CMOS(TTL compatible) output levels. The receiver supports a TRI-STATE function that may beused to multiplex outputs. The DS90C032 and companion line driver (DS90C031) provide a new alternative to high powerpseudo-ECL devices for high speed point to point interfaces. In addition, the DS90C032A provides power-off high impedance LVDS inputs. This featureassures minimal loading effect on the LVDS bus lines when VCC is not present. Industry Part NumberDS90C032NS Part NumbersDS90C032E-QMLDS90C032W-QMLDS90C032W-QMLVDS90C032WG-QMLDS90C032WG-QMLVDS90C032WGLQMLVDS90C032WLQMLVPrime DieDS90C032Controlling DocumentSEE FEATURES SECTIONProcessingMIL-STD-883, Method 5004 oSubgrp Description Temp ( C)12345678A8B91011Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at +25+125-55+25+125-55+25+125-55+25+125-55Quality Conformance InspectionMIL-STD-883, Method 5005 1元器件交易网www.cecb2b.com

MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEETFeatures- High impedance LVDS inputs with power-off - Accepts small swing (330 mV) differential signal levels. - Low power dissipation. - Low differential skew. - Low chip to chip skew - Mil operating temperature range - Pin compatible with DS26C32A. - Compatible with IEEE P1596.3 SCI LVDS draft standard - Typical Rise/Fall time is TBD CONTROLLING DOCUMENTS: DS90C032E-QML 5962-9583401Q2A DS90C032W-QML 5962-9583401QFA DS90C032W-QMLV 5962-9583401VFA DS90C032WG-QML 5962-9583401QZA DS90C032WG-QMLV 5962-9583401VZA DS90C032WGLQMLV 5962-9583401VZA DS90C032WLQMLV 5962L9583401VFA 2元器件交易网www.cecb2b.com

MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEET(Absolute Maximum Ratings)(Note 1)Supply Voltage (Vcc)Input Voltage (RIN+, RIN-)Enable Input Voltage (EN, EN*)Output Voltage (ROUT)Storage Temperature Range (Tstg)Lead TemperatureSoldering 4 secondsMaximum Package Power Dissipation @ +25C(Note 2)20 PIN LCC (E Pkg)16 PIN CERPAK (W Pkg)16 PIN CERAMIC SOIC (WG Pkg)Thermal Resistance. (Theta JA)20 PIN LCC (E Pkg)16 PIN CERPAK (W Pkg)16 PIN CERAMIC SOIC (WG Pkg)Thermal Resistance. (Theta JC)20 PIN LCC (E Pkg).16 PIN CERPAK (W Pkg)16 PIN CERAMIC SOIC (WG Pkg)ESD Rating.Note 1:-0.3 to +6V-0.3 to (Vcc+0.3V)-0.3 to (Vcc+0.3V)-0.3 to (Vcc+0.3V)-65 C < Ta < + 150 C260 C1830 mW1400 mWTBD 82 C/W148 C/WTBD 20 C/W 20 C/WTBD2000 Volts.Note 2:Absolute Maximum Ratings are those values beyond which the safety of the devicecannot be guaranteed. They are not meant to imply that the device should be operatedat these limits. The table of \"Electrical Characteristics\" provides conditions foractual device operation. Derate (E Pkg) @ 12.2mW/C above +25C. Derate (W Pkg) @ 6.8 mW/C above +25C. Recommended Operating ConditionsOperating Voltage (Vcc)Operating Temperature Range (Ta)Receiver Input Voltage4.5V to 5.5V-55C to +125CGND to 2.4V3元器件交易网www.cecb2b.com

MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETERS: (SEE NOTE 4)SYMBOLVTLPARAMETERDifferentialInput LowThresholdDifferentialInput HighThresholdInput CurrentVcm = +1.2VCONDITIONSNOTES1PIN-NAMERIN+,RIN-RIN+,RIN-RIN+,RIN-RIN+,RIN-RIN+,RIN-RIN+,RIN-ROUTROUTROUTROUT11VCC = 5.5VIcl = -18mAEN, EN* = Vcc or GND, Inputs OpenEN, EN* = 2.4 or 0.5, Inputs OpenIccZNo Load SupplyCurrent ReceiversDisabledEN = GND, EN* = Vcc , Inputs OpenEN,EN*EN,EN*EN, EN*EN, EN*VccVccVcc2.00.8+10-1.5111111-153.80.3-100+10MINMAX-100UNITmVSUB-GROUPS1, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,31, 2,3VTHVcm = +1.2V1100mVIINVcc=5.5V, Vin = 2.4VVcc = 5.5V, Vin = 0Vcc = 0.0V, Vin = 2.4VVcc = 0.0V, Vin = 0.0V+10+10+10+10uAuAuAuAVVmAuA VVuAVmAmAmAVOHVOLIOSIOZVIHVILIIVCLIccOutput HighVoltageOutput LowVoltageOutput ShortCircuit CurrentOutput TRI-STATECurrentInput HighVoltageInput Low VoltageInput CurrentInput ClampVoltageNo Load SupplyCurrentVcc= 4.5V, Ioh = -0.4 mA, Vid = 200mVVcc = 4.5, Iol = 2 mA, Vid = -200mVEnabled, Vout = 0VDisabled, Vout = 0V or Vcc4元器件交易网www.cecb2b.com

MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEETElectrical CharacteristicsAC PARAMETERS: (SEE NOTE 4)(The following conditions apply to all the following parameters, unless otherwise specified.)AC:VCC = 4.5V/5.0V/5.5V, CL = 20pFSYMBOLtPHLDPARAMETERDifferentialPropagation DelayHigh to LowDifferentialPropagation DelayLow to HighDifferential Skew|tPHLD-tPLHD|Channel toChannel SkewChip to Chip SkewDisable Time Lowto ZDisable Time Highto ZEnable Time Z toHighEnable Time Z toLowCONDITIONSVid = 200mV, Input pulse = 1.1V to1.3V, Vin = 1.2V (0 differential) toVout = 1/2 VccVid = 200mV, Input pulse = 1.1V to1.3V, Vin = 1.2V (0V differential) toVout = 1/2 VccCL = 20pF, Vid = 200mVCL = 20pF, Vid = 200mVCL = 20pF, Vid = 200mVInput pulse = 0V to 3.0V, Vin = 1.5V,Vout = Vol+0.5V, Rload = 1k Ohm to VCCInput pulse = 0V to 3.0V, Vin = 1.5V,Vout = Voh-0.5V, Rload = 1k Ohm to GNDInput pulse = 0V to 3.0V, Vin = 1.5V,Vout = 50%, Rload = 1k Ohm to GNDInput pulse = 0V to 3.0V, Vin = 1.5V,Vout = 50%, Rload = 1k Ohm to VCC23NOTESPIN-NAMEMIN1.08MAXUNITnsSUB-GROUPS9, 10,119, 10,119, 10,119, 10,119, 10,119, 10,119, 10,119, 10,119, 10,11tPLHD1.08nstSKDtSK1tSK2tPLZtPHZtPZHtPZL33720202020nsnsnsnsnsnsnsAC/DC PARAMETERS: POST RADIATION LIMITS (SEE NOTE 4)IccNo Load SupplyCurrentNo Load SupplyCurrent ReceiversDisabledNote 1:Note 2:Note 3:Note 4:EN, EN* = Vcc or GND, Inputs OpenEN, EN* = 2.4 or 0.5, Inputs OpenEN = GND, EN* = Vcc, Inputs Open202020mAmAmA111IcczTested during VOH/VOL tests. Channel to Channel Skew is defined as the difference between the propagation delay ofone channel and that of the others on the same chip with an event on the inputs. Chip to Chip Skew is defined as the difference between the minimum and maximumspecified differential propagation delays. Pre and post irradiaton limits are identical to those listed under AC and DCelectrical characteristics except as listed in the Post Radiation Limits Table (IFAPPLICABLE). Radiation end point limits for the noted parameters are guaranteed onlyfor the conditions as specified. 5元器件交易网www.cecb2b.com

MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEETGraphics and DiagramsGRAPHICS#E20AREW16ARLWG16ARCDESCRIPTIONLCC (E), TYPE C, 20 TERMINAL(P/P DWG)CERPACK (W), 16 LEAD (P/P DWG)CERAMIC SOIC (WG), 16 LEAD (P/P DWG)See attached graphics following this page.6元器件交易网www.cecb2b.com元器件交易网www.cecb2b.com

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MNDS90C032-X-RH REV 1B1MICROCIRCUIT DATA SHEETRevision HistoryRev0A01A1ECN #Rel DateOriginatorRose MaloneRose MaloneChangesInitial MDS ReleaseUpdate MDS: MNDS90C032-X-RH, Rev. 0A0 toMNDS90C032-X-RH, Rev. 1A1. Added reference to WG pkgto Main Table, Features Section, Absolute MaximumSection and Graphics Section.Update MDS: MNDS90C032-X-RH, Rev. 1A1 to 1B1. MDSenhancements: Additional verbage to the generaldiscription, Main Table and Added new bullet to theFeatures Section.M000384406/21/02M000401208/15/031B1M000418208/15/03Rose Malone7